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半導体製造装置の世界市場:フロントエンド/バックエンド別、実装技術別、2023年予測

Semiconductor Manufacturing Equipment Market by Front-end Equipment (Lithography, Wafer Surface Conditioning, Cleaning Processes), Backend Equipment (Assembly & Packaging, Dicing, Bonding, Metrology), Fab Facility, and Geography - Global Forecast to 2023

出版元:MarketsandMarkets(米国)LinkIcon出版元について
発行年:2017年6月
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【レポート紹介】
半導体製造装置の世界市場規模は2016年段階で390億ドルと推計されます。市場は2017年から2023年にかけて平均年伸長率6.86%の成長で推移、2023年には625億ドル市場にまで拡大するとレポートでは予測しています。
当レポートでは、2023年に至る半導体製造装置の世界市場予測(市場規模US$)、フロントエンド装置別市場(リソグラフィ、ウェーハ表面調製装置各種、洗浄工程、その他)、バックエンド装置別市場(バックエンドプロセス各種)、ファブファシリティ別市場(オートメーション、化学物質制御装置、ガス制御装置、その他)、実装技術別市場(2D、2.5D、3D)、主要国地域別市場など、詳細な市場予測データと分析を掲載しています。また市場分析、競合状況、主要メーカー企業12社プロフィール動向などの情報も交えて、半導体製造装置市場の現在と今後展開を予測分析していきます。

【レポート構成概要】pic01_Semi.jpg
◆ 半導体製造装置の世界市場予測2014-2023年
・市場規模(US$)

◆ フロントエンド装置別、市場-2023年
リソグラフィ
ウェーハ表面調製装置
・エッチング
・化学機械的平面化
洗浄工程
その他
※ 市場規模US$

◆ バックエンド装置別、市場-2023年
バックエンドプロセス
・組み立て、パッケージング装置
・ダイシング装置
・ボンディング装置
・メトロロジー装置
・試験装置
※ 市場規模US$

◆ ファブファシリティ別、市場-2023年
・オートメーション
・化学物質制御装置(chemical control equipment)
・ガス制御装置(gas control equipment)
・その他
※市場規模US$

◆ 実装技術別、市場-2023年
・2D
・2.5D
・3D
※市場規模US$

◆主要国地域別市場-2023年
北米
・米国、カナダ、メキシコ
欧州
・英国、イタリア、アイルランド、フランス
・その他欧州
アジア太平洋
・日本、中国、台湾、韓国
・その他アジア太平洋
※ 国地域別にフロントエンド装置別、バックエンド装置別の細分化データ掲載、詳細は目次参照
※ 市場規模US$

◆市場分析
・市場ダイナミクス(ドライバー、障壁、機会、課題)
・バリューチェーン分析
・競合状況

◆ 半導体製造装置の主要企業プロフィール動向
・東京エレクトロン株式会社
・LAM RESEARCH CORPORATION
・ASML HOLDINGS N.V.
・APPLIED MATERIALS INC.
・KLA-TENCOR CORPORATION.
・株式会社SCREENホールディングス
・TERADYNE INC
・株式会社アドバンテスト
・株式会社日立ハイテクノロジーズ
・PLASMA-THERM
・RUDOLPH TECHNOLOGIES, INC
・STARTUP ECOSYSTEM

(全162頁)
【レポート詳細目次、データ項目一覧は当ページ下を参照ください】

英文詳細目次(table of contents)

【原文詳細目次】

Semiconductor Manufacturing Equipment Market by Front-end Equipment (Lithography, Wafer Surface Conditioning, Cleaning Processes), Backend Equipment (Assembly & Packaging, Dicing, Bonding, Metrology), Fab Facility, and Geography - Global Forecast to 2023

Table of Contents

1 INTRODUCTION 14

1.1 OBJECTIVES OF THE STUDY 14
1.2 MARKET DEFINITION 14
1.3 SCOPE OF THE STUDY 15
1.3.1 MARKETS COVERED 15
1.3.2 YEARS CONSIDERED FOR THE STUDY 15
1.4 CURRENCY 16
1.5 PACKAGE AND SIZE 16
1.6 LIMITATIONS 16
1.7 STAKEHOLDERS 16

2 RESEARCH METHODOLOGY 17

2.1 RESEARCH DATA 17
2.1.1 SECONDARY DATA 18
2.1.1.1 Key data from secondary sources 18
2.1.2 PRIMARY DATA 18
2.1.2.1 Key data from primary sources 19
2.1.2.2 Key industry insights 20
2.1.2.3 Breakdown of primaries 20
2.2 MARKET SIZE ESTIMATION 21
2.2.1 BOTTOM-UP APPROACH 21
2.2.2 TOP-DOWN APPROACH 21
2.3 MARKET BREAKDOWN AND DATA TRIANGULATION 23
2.4 RESEARCH ASSUMPTIONS 24

3 EXECUTIVE SUMMARY 25
4 PREMIUM INSIGHTS 30

4.1 ATTRACTIVE GROWTH OPPORTUNITIES IN THE SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET 30
4.2 SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY FRONT-END 31
4.3 SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET IN APAC 32
4.4 GROWTH RATE OF THE LEADING COUNTRIES IN SEMICONDUCTOR MANUFACTURING EQUIPMENT, 2016 32
4.5 SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY DIMENSION 33

5 MARKET OVERVIEW 34

5.1 VALUE CHAIN ANALYSIS 35
5.1.1 VALUE CHAIN ANALYSIS (FRONT-END MANUFACTURING EQUIPMENT) 35
5.1.2 VALUE CHAIN ANALYSIS (BACK-END MANUFACTURING EQUIPMENT) 36
5.2 MARKET DYNAMICS 37
5.2.1 DRIVERS 37
5.2.1.1 Progress in research and development facilities 37
5.2.1.2 Increasing demand for electric and hybrid vehicles 38
5.2.1.3 Growing consumer electronics market and increase in the number of foundries 39
5.2.2 RESTRAINTS 39
5.2.2.1 High costs and maintenance of the equipment 39
5.2.2.2 Complexity of pattern and functional defects in manufacturing process 40
5.2.3 OPPORTUNITIES 40
5.2.3.1 Rise in demand for silicon-based sensors in IoT 40
5.2.3.2 Expanding chip industry in China 40
5.2.3.3 Growing number of data centers and servers 42
5.2.4 CHALLENGES 42
5.2.4.1 Technical problems faced during fabrication process 42
5.2.4.2 Increased complexities related to miniaturized structures of circuit 43

6 SEMICONDUCTOR MANUFACTURING MARKET, BY FRONT-END EQUIPMENT 44

6.1 INTRODUCTION 45
6.2 LITHOGRAPHY 46
6.2.1 DUV 47
6.2.2 EUV 48
6.3 WAFER SURFACE CONDITIONING EQUIPMENT 48
6.3.1 ETCHING 50
6.3.2 CHEMICAL MECHANICAL PLANARIZATION 51
6.4 CLEANING PROCESS 52
6.4.1 SINGLE-WAFER SPRAY SYSTEM 53
6.4.2 SINGLE-WAFER CRYOGENIC SYSTEM 54
6.4.3 BATCH IMMERSION CLEANING SYSTEM 54
6.4.4 BATCH SPRAY CLEANING SYSTEM 55
6.4.5 SCRUBBER 55
6.5 OTHERS 55
6.5.1 CVD 56

7 SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY BACK-END 57

7.1 INTRODUCTION 58
7.2 BACK-END PROCESSES 59
7.2.1 ASSEMBLY AND PACKAGING 59
7.2.1.1 Assembly 59
7.2.1.2 Packaging equipment 59
7.2.2 DICING EQUIPMENT 60
7.2.3 BONDING EQUIPMENT 61
7.2.4 METROLOGY EQUIPMENT 62
7.2.5 TEST EQUIPMENT 63

8 SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY FAB FACILITY 65

8.1 INTRODUCTION 66
8.2 AUTOMATION 66
8.3 CHEMICAL CONTROL EQUIPMENT 67
8.4 GAS CONTROL EQUIPMENT 67
8.5 OTHERS 67

9 SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY DIMENSION 68

9.1 INTRODUCTION 69
9.2 2D 69
9.3 2.5D 70
9.4 3D 70

10 SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY GEOGRAPHY 72

10.1 INTRODUCTION 73
10.2 NORTH AMERICA 75
10.2.1 US 83
10.2.1.1 Some of the major semiconductor device manufacturers belong
to the US 83
10.2.2 CANADA 83
10.2.3 MEXICO 84
10.3 EUROPE 84
10.3.1 UK 92
10.3.1.1 Effort to increase the growth of semiconductor manufacturing equipment 92
10.3.2 ITALY 92
10.3.2.1 One of the leading countries of Europe 92
10.3.3 IRELAND 93
10.3.3.1 High experience in semiconductor market 93
10.3.4 FRANCE 93
10.3.4.1 One of the largest electronic market in Europe 93
10.3.5 REST OF EUROPE 93
10.4 ASIA PACIFIC 93
10.4.1 CHINA 103
10.4.1.1 Semiconductor manufacturing equipment market for China in APAC is expected to grow at a high rate 103
10.4.2 JAPAN 103
10.4.2.1 Presence of major players in Japan 103
10.4.3 TAIWAN 104
10.4.3.1 Taiwan being a major semiconductor manufacturer hub is expected to boost the demand for semiconductor manufacturing equipment 104
10.4.4 SOUTH KOREA 104
10.4.4.1 Second largest semiconductor industry in the world 104
10.4.5 REST OF APAC 104

11 COMPETITIVE LANDSCAPE 105

11.1 OVERVIEW 105
11.2 MARKET RANKING ANALYSIS FOR SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET 106
11.3 SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET DIVE CHART 107
11.3.1 VANGUARDS 107
11.3.2 DYNAMIC 107
11.3.3 INNOVATORS 107
11.3.4 EMERGING 107
11.3.5 MICRO QUADRANT 108
11.3.5.1 Product offering parameters 109
11.3.5.2 Business strategy parameters 110
11.4 COMPETITIVE SITUATIONS AND TRENDS 111
11.4.1 PRODUCT LAUNCHES 112
11.4.2 CONTRACTS, PARTNERSHIP, AGREEMENTS, AND COLLABORATIONS 113
11.4.3 MERGER & ACQUISITION 114
11.4.4 EXPANSIONS AND AWARDS 115
*Top 25 companies analyzed for this study are -ASML Holdings N.V., Nikon, Canon, JEOL, Nuflare Technology, Ultratech, Rudolph Technology, EV Group, SCREEN Semiconductor Solutions Co., Ltd, Toshiba, TOKYO OHKA KOGYO CO., LTD, Adams Lithographing , AM Lithography Corporation, Vistec Electron Beam GmbH, Qoniac GmbH, S-Cubed, Inc., Inpria, Zeiss, Mapper Lithography, Raith GmbH, Gigaphoton Inc, Energetiq Technology, Inc, SuSS Microtech AG, NIL Technology

12 COMPANY PROFILE 116

(OVERVIEW, PRODUCTS AND SERVICES, FINANCIALS, STRATEGY & DEVELOPMENT)*
12.1 INTRODUCTION 116
12.2 TOKYO ELECTRON LIMITED 117
12.3 LAM RESEARCH CORPORATION 120
12.4 ASML HOLDINGS N.V. 123
12.5 APPLIED MATERIALS INC. 126
12.6 KLA-TENCOR CORPORATION. 129
12.7 SCREEN HOLDINGS CO., LTD. 132
12.8 TERADYNE INC. 135
12.9 ADVANTEST CORPORATION 138
12.10 HITACHI HIGH-TECHNOLOGIES CORPORATION. 141
12.11 PLASMA-THERM. 144
12.12 RUDOLPH TECHNOLOGIES, INC 147
12.13 STARTUP ECOSYSTEM 150
*Details on Overview, Products and Services, Financials, Strategy & Development might not be Captured in case of Unlisted Companies.
13 APPENDIX 152

LIST OF TABLES

TABLE 1 FRONT-END EQUIPMENT SHIPMENT UNIT, 2014-2023 26
TABLE 2 PRESENCE OF DOMESTIC COMPANIES IN DIFFERENT SEMICONDUCTOR MANUFACTURING EQUIPMENT 41
TABLE 3 FRONT-END SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET,
BY TYPE, 2014–2023 (USD BILLION) 45
TABLE 4 FRONT-END SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET,
BY GEOGRAPHY 2014–2023 (USD BILLION) 46
TABLE 5 FRONT-END LITHOGRAPHY EQUIPMENT MARKET, BY GEOGRAPHY,
2014–2023 (USD BILLION) 47
TABLE 6 FRONT-END WAFER SURFACE CONDITIONING EQUIPMENT MARKET,
BY TYPE, 2014–2023 (USD BILLION) 49
TABLE 7 FRONT-END WAFER CONDITIONING EQUIPMENT MARKET, BY GEOGRAPHY,
2014–2023 (USD BILLION) 50
TABLE 8 ETCHING WAFER CONDITIONING EQUIPMENT MARKET, BY GEOGRAPHY,
2014–2023 (USD BILLION) 51
TABLE 9 CMP WAFER CONDITIONING EQUIPMENT MARKET, BY GEOGRAPHY,
2014–2023 (USD BILLION) 52
TABLE 10 WAFER CLEANING EQUIPMENT MARKET, BY GEOGRAPHY,
2014–2023 (USD BILLION) 53
TABLE 11 OTHER WAFER PROCESSING EQUIPMENT MARKET, BY GEOGRAPHY,
2014–2023 (USD BILLION) 55
TABLE 12 BACK-END SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY TYPE, 2014–2023 (USD BILLION) 58
TABLE 13 BACK-END SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET,
BY GEOGRAPHY, 2014–2023 (USD BILLION) 58
TABLE 14 BACK-END ASSEMBLY AND PACKAGING EQUIPMENT MARKET, BY GEOGRAPHY, 2014–2023 (USD BILLION) 60
TABLE 15 BACK-END DICING EQUIPMENT MARKET, BY GEOGRAPHY,
2014–2023 (USD BILLION) 61
TABLE 16 BACK-END BONDING EQUIPMENT MARKET, BY GEOGRAPHY,
2014–2023 (USD BILLION) 62
TABLE 17 BACK-END METROLOGY EQUIPMENT MARKET, BY GEOGRAPHY,
2014–2023 (USD BILLION) 63
TABLE 18 BACK-END WAFER TESTING EQUIPMENT MARKET, BY GEOGRAPHY,
2014–2023 (USD BILLION) 64
TABLE 19 SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY FAB FACILITY, 2014–2023 (USD BILLION) 66
TABLE 20 SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY DIMENSION,
2014–2023, (USD BILLION) 69
TABLE 21 COMPARISON BETWEEN 2D, 2.5D, AND 3D IC TECHNOLOGY 71
TABLE 22 SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY GEOGRAPHY
2014–2023 (USD BILLION) 75
TABLE 23 NORTH AMERICA SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET,
BY COUNTRY, 2014–2023 (USD BILLION) 77
TABLE 24 NORTH AMERICA SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET,
BY TYPE, 2014–2023 (USD BILLION) 78
TABLE 25 LITHOGRAPHY EQUIPMENT MARKET IN NORTH AMERICA, BY COUNTRY,
2014–2023, (USD BILLION) 78
TABLE 26 ETCHING EQUIPMENT MARKET IN NORTH AMERICA, BY COUNTRY, 2014–2023, (USD BILLION) 79
TABLE 27 CMP EQUIPMENT MARKET IN NORTH AMERICA, BY COUNTRY, 2014–2023,
(USD BILLION) 79
TABLE 28 WAFER CLEANING EQUIPMENT MARKET IN NORTH AMERICA, BY COUNTRY,
2014–2023, (USD BILLION) 79
TABLE 29 OTHER WAFER PROCESSING EQUIPMENT MARKET IN NORTH AMERICA,
BY COUNTRY, 2014–2023, (USD BILLION) 80
TABLE 30 ASSEMBLY AND PACKAGING EQUIPMENT MARKET IN NORTH AMERICA,
BY COUNTRY, 2014–2023, (USD BILLION) 80
TABLE 31 DICING EQUIPMENT MARKET IN NORTH AMERICA, BY COUNTRY,
2014–2023, (USD BILLION) 80
TABLE 32 BONDING EQUIPMENT MARKET IN NORTH AMERICA BY COUNTRY,
2014–2023, (USD BILLION) 81
TABLE 33 METROLOGY EQUIPMENT MARKET IN NORTH AMERICA, BY COUNTRY,
2014–2023, (USD BILLION) 81
TABLE 34 WAFER TESTING EQUIPMENT MARKET IN NORTH AMERICA, BY COUNTRY,
2014–2023, (USD BILLION) 82
TABLE 35 SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET IN NORTH AMERICA,
BY DIMENSION, 2014–2023, (USD BILLION) 83
TABLE 36 SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET IN EUROPE,
BY COUNTRY, 2014–2023, (USD BILLION) 85
TABLE 37 EUROPE SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY TYPE, 2014–2023 (USD BILLION) 85
TABLE 38 LITHOGRAPHY EQUIPMENT MARKET IN EUROPE, BY COUNTRY,
2014–2023 (USD BILLION) 86
TABLE 39 ETCHING EQUIPMENT MARKET IN EUROPE, BY COUNTRY,
2014–2023 (USD BILLION) 86
TABLE 40 EUROPE: CMP EQUIPMENT MARKET IN EUROPE, BY COUNTRY,
2014–2023, (USD BILLION) 87
TABLE 41 WAFER CLEANING EQUIPMENT MARKET IN EUROPE, BY COUNTRY,
2014–2023, (USD BILLION) 87
TABLE 42 EUROPE: OTHER WAFER PROCESSING EQUIPMENT MARKET IN EUROPE,
BY COUNTRY, 2014–2023, (USD BILLION) 88
TABLE 43 ASSEMBLY AND PACKAGING EQUIPMENT MARKET IN EUROPE, BY COUNTRY, 2014–2023, (USD BILLION) 89
TABLE 44 WAFER DICING EQUIPMENT MARKET IN EUROPE, BY COUNTRY,
2014–2023, (USD MILLION) 89
TABLE 45 BONDING EQUIPMENT MARKET IN EUROPE, BY COUNTRY,
2014–2023, (USD MILLION) 90
TABLE 46 METROLOGY EQUIPMENT MARKET IN EUROPE, BY COUNTRY,
2014–2023, (USD BILLION) 90
TABLE 47 WAFER TESTING EQUIPMENT MARKET IN EUROPE, BY COUNTRY,
2014–2023, (USD BILLION) 91
TABLE 48 SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET IN EUROPE,
BY DIMENSION, 2014–2023, (USD BILLION) 92
TABLE 49 SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET IN APAC,
BY COUNTRY, 2014–2023, (USD BILLION) 95
TABLE 50 APAC SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY TYPE,
2014–2023 (USD BILLION) 96
TABLE 51 LITHOGRAPHY EQUIPMENT MARKET IN APAC, BY COUNTRY,
2014–2023, (USD BILLION) 96
TABLE 52 ETCHING EQUIPMENT MARKET IN APAC, BY COUNTRY, 2014–2023, (USD BILLION) 97
TABLE 53 CMP EQUIPMENT MARKET IN APAC, BY COUNTRY, 2014–2023, (USD BILLION) 97
TABLE 54 WAFER CLEANING EQUIPMENT MARKET IN APAC, BY COUNTRY,
2014–2023, (USD BILLION) 98
TABLE 55 OTHER WAFER PROCESSING EQUIPMENT MARKET IN APAC, BY COUNTRY,
2014–2023, (USD BILLION) 99
TABLE 56 ASSEMBLY AND PACKAGING EQUIPMENT MARKET IN APAC, BY COUNTRY,
2014–2023, (USD BILLION) 99
TABLE 57 WAFER DICING EQUIPMENT MARKET IN APAC, BY COUNTRY,
2014–2023, (USD BILLION) 100
TABLE 58 WAFER BONDING EQUIPMENT MARKET IN APAC, BY COUNTRY,
2014–2023, (USD BILLION) 100
TABLE 59 METROLOGY EQUIPMENT MARKET IN APAC, BY COUNTRY,
2014–2023, (USD BILLION) 101
TABLE 60 WAFER TESTING EQUIPMENT MARKET IN APAC, BY COUNTRY,
2014–2023, (USD BILLION) 101
TABLE 61 SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET IN APAC,
BY DIMENSION, 2014–2023, (USD BILLION) 102
TABLE 62 RANKING OF TOP 5 PLAYERS: POWER BANK MARKET, 2016 106
TABLE 63 PRODUCT LAUNCHES, 2015–2017 112
TABLE 64 CONTRACTS, AGREEMENTS, AND COLLABORATIONS, 2015-2017 113
TABLE 65 MERGER AND ACQUISITION, 2015-2017 114
TABLE 66 EXPANSIONS AND AWARDS, 2015-2017 115

LIST OF FIGURES

FIGURE 1 MARKETS COVERED 15
FIGURE 2 RESEARCH DESIGN 17
FIGURE 3 MARKET SIZE ESTIMATION METHODOLOGY: BOTTOM-UP APPROACH 21
FIGURE 4 MARKET SIZE ESTIMATION METHODOLOGY: TOP-DOWN APPROACH 22
FIGURE 5 DATA TRIANGULATION 23
FIGURE 6 ASSUMPTIONS OF THE RESEARCH STUDY 24
FIGURE 7 IN NORTH AMERICA 3D SEGMENT IS EXPECTED TO GROW AT THE HIGHEST CAGR DURING THE FORECAST PERIOD 25
FIGURE 8 APAC TO GROW AT THE HIGHEST RATE IN THE SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET DURING THE FORECAST PERIOD 26
FIGURE 9 LITHOGRAPHY EQUIPMENT TO HOLD LARGE DEMAND IN THE SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET DURING THE FORECAST PERIOD 27
FIGURE 10 BONDING EQUIPMENT IS EXPECTED TO WITNESS THE HIGHEST GROWTH BETWEEN 2017 AND 2023 28
FIGURE 11 APAC HELD THE LARGEST MARKET SHARE IN 2016 29
FIGURE 12 GROWING CONSUMER ELECTRONICS MARKET AND INCREASE IN THE NUMBER OF FOUNDRIES ARE DRIVING THE SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET 30
FIGURE 13 LITHOGRAPHY EQUIPMENT IS EXPECTED TO HOLD THE LARGEST MARKET SHARE FOR SEMICONDUCTOR MANUFACTURING EQUIPMENT DURING THE FORECAST PERIOD 31
FIGURE 14 TAIWAN HELD THE LARGEST SHARE OF THE SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET IN APAC IN 2016 32
FIGURE 15 APAC IS EXPECTED TO GROW AT A HIGHEST CAGR DURING THE FORECAST PERIOD 32
FIGURE 16 3D IS EXPECTED TO HOLD THE HIGHEST SHARE BETWEEN 2017 AND 2023 33
FIGURE 17 VALUE CHAIN ANALYSIS: SEMICONDUCTOR MANUFACTURING EQUIPMENT 35
FIGURE 18 GROWING DEMAND FOR CONSUMER ELECTRONICS AND ELECTRIC-BASED AUTOMOBILES ARE THE MAJOR DRIVERS FOR THE SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET 37
FIGURE 19 INCREASING SALES OF ELECTRIC VEHICLES BETWEEN 2011 AND 2014 38
FIGURE 20 LITHOGRAPHY EQUIPMENT ACCOUNTS FOR THE LARGEST MARKET SHARE AMONG ALL EQUIPMENT TYPES IN 2017 45
FIGURE 21 CMP MARKET IS EXPECTED TO GROW WITH THE HIGHEST CAGR DURING THE FORECAST PERIOD 49
FIGURE 22 APAC MARKET IS EXPECTED TO GROW WITH THE HIGHEST CAGR DURING THE FORECAST PERIOD 53
FIGURE 23 SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY GEOGRAPHY 73
FIGURE 24 CHINA EXPECTED TO REGISTER THE HIGHEST GROWTH RATE IN THE SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET DURING THE FORECAST PERIOD 74
FIGURE 25 APAC HOLDS THE LARGEST MARKET IN SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET IN 2017 74
FIGURE 26 NORTH AMERICA, GEOGRAPHIC SNAPSHOT, 2016 76
FIGURE 27 SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET IN THE US IS EXPECTED TO GROW WITH THE HIGHEST CAGR DURING THE FORECAST PERIOD 77
FIGURE 28 3D MARKET IS EXPECTED TO GROW AT THE HIGHEST CAGR DURING THE FORECAST PERIOD 82
FIGURE 29 GERMANY IS EXPECTED TO GROW WITH THE HIGHEST CAGR BETWEEN 2017
AND 2023 84
FIGURE 30 GERMANY ACCOUNTS FOR LARGEST MARKET IN ASSEMBLY AND PACKAGING MARKET IN 2017 88
FIGURE 31 AMONG ALL DIMENSIONS 3D MARKET IN EUROPE IS EXPECTED TO GROW AT THE HIGHEST CAGR DURING THE FORECAST PERIOD 91
FIGURE 32 APAC, GEOGRAPHIC SNAPSHOT, 2016 94
FIGURE 33 TAIWAN HOLDS LARGEST MARKET SHARE AMONG ALL APAC COUNTRIES IN 2017 95
FIGURE 34 TAIWAN HOLDS LARGEST MARKET FOR APAC WAFER CLEANING EQUIPMENT MARKET 98
FIGURE 35 3D MARKET IS EXPECTED TO GROW AT THE HIGHEST CAGR DURING THE FORECAST PERIOD 102
FIGURE 36 COMPANIES ADOPTED PRODUCT LAUNCHES AS KEY GROWTH STRATEGY BETWEEN 2014 AND 2017 105
FIGURE 37 DIVE CHART 108
FIGURE 38 BATTLE FOR MARKET SHARE: PRODUCT LAUNCHES WAS THE KEY STRATEGY BETWEEN 2014 AND 2017 111
FIGURE 39 TOKYO ELECTRON LIMITED: COMPANY SNAPSHOT 117
FIGURE 40 LAM RESEARCH CORPORATION: COMPANY SNAPSHOT 120
FIGURE 41 ASML HOLDINGS N.V.: COMPANY SNAPSHOT 123
FIGURE 42 APPLIED MATERIALS INC.: COMPANY SNAPSHOT 126
FIGURE 43 KLA-TENCORE CORPORATION: COMPANY SNAPSHOT 129
FIGURE 44 SCREEN HOLDINGS CO., LTD.: COMPANY SNAPSHOT 132
FIGURE 45 TERADYNE INC.: COMPANY SNAPSHOT 135
FIGURE 46 ADVANTEST CORPORATION: COMPANY SNAPSHOT 138
FIGURE 47 HITACHI HIGH-TECHNOLOGIES CORPORATION: COMPANY SNAPSHOT 141
FIGURE 48 RUDOLPH TECHNOLOGIES, INC: COMPANY SNAPSHOT 147

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