関連レポート

先端半導体パッケージングの世界市場：2031年予測

出版元：MarketsandMarkets  出版元について

発行年：2024年3月

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当調査レポートは英文 252ページになります。

商品コード：MAM3579

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レポート紹介

半導体パッケージング材料の世界市場規模は2024年で439億ドル、2029年に709億ドル、市場の平均年成長率は10.1%にて増加すると見込まれています。

レポートは半導体パッケージング材料の世界市場について2029年までの市場予測データ(金額US$)を掲載しています。同市場をさまざまな区分で細分化し、そのセグメント市場ごとの市場予測（タイプ別市場、包装技術別市場、等）を中心に構成されています。また競合状況、主要企業情報（10社）、エコシステムマップ、技術分析なども加味し、半導体パッケージング材料市場の動向および今後成長性を詳細にレポートしています。

【レポート構成概要】
◆半導体パッケージング材料市場の世界市場予測2020-2029年
・市場規模(US$)

◆タイプ別、市場-2029年
・有機基板
・ボンディングワイヤ
・リードフレーム
・カプセル化樹脂
・ダイアタッチ材
・セラミックパッケージ
・熱伝導材料(TIM)
・はんだボール
・その他タイプ
※(市場規模US$)　

◆パッケージング技術別、市場-2029年
・スモールアウトラインパッケージ (SOP)
・グリッドアレイ（GA）
・クアッドフラットノーリード（QFN）
・デュアルフラットノーリード（DFN）
・クアッドフラットパッケージ (QFP)
・デュアルインライン（DIP）
・その他技術
※(市場規模US$)　

◆エンドユーズ産業別、市場-2029年
・コンシューマーエレクトロニクス
・自動車
・ヘルスケア
・IT、通信
・航空宇宙、防衛
・その他エンドユーズ産業
※(市場規模US$)　

◆主要国地域別市場-2029年
アジア太平洋
・日本、中国、インド
・韓国、台湾
・その他アジア太平洋
北米
・米国、カナダ、メキシコ
欧州
・ドイツ、イタリア、フランス
・英国、スペイン
・その他欧州
中東アフリカ
・UAE、イスラエル、南アフリカ共和国
・その他中東アフリカ
南米
・アルゼンチン、ブラジル
・その他南米
※地域別に、全セグメント別の細分化データ掲載
※国別に、エンドユーズ産業別の細分化データ掲載、詳細は目次参照

◆市場分析
・市場ダイナミクス
・バリューチェーン分析
・平均価格分析
・エコシステムマップ
・技術分析
・特許分析
・貿易分析
・規制状況
・ファイブフォース分析
・主要なステークホルダーと購買基準
・ケーススタディ分析
・競合状況
・市場シェア分析

◆半導体パッケージング材料市場の主要企業プロフィール動向
・LG CHEM
・JIANGSU CHANGJIAN TECHNOLOGY CO, LTD
・HENKEL AG & CO KGAA
・京セラ株式会社
・ASE
・SILICONWARE PRECISION INDUSTRIES CO, LTD
・AMKOR TECHNOLOGY
・TEXAS INSTRUMENTS
・IBIDEN CO, LTD
・POWERTECH TECHNOLOGY INC

その他企業
・CHIPMOS TECHNOLOGIES INC
・TONG HSING ELECTRONIC INDUSTRIES LTD
・NEPES CORPORATION LIMITED
・新光電気工業株式会社
・DAEDUCK ELECTRONICS CO, LTD
・MACDERMID PERFORMANCE SOLUTIONS
・ルネサスエレクトロニクス株式会社
・SAMSUNG ELECTRO-MECHANICS
・UNIMICRON TECHNOLOGY CORPORATION
・CHIPBOND TECHNOLOGY CORPORATION
・田中貴金属工業株式会社
・NAN YA PLASTICS CORPORATION
・株式会社日立ハイテク
・住友化学株式会社
・VERISILICON

（全252頁）

Table of Contents (英文詳細目次）

1 INTRODUCTION 23

1.1 STUDY OBJECTIVES 23
1.2 MARKET DEFINITION 23
1.3 INCLUSIONS & EXCLUSIONS 24
1.4 MARKET SCOPE 25
・ FIGURE 1 SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SEGMENTATION 25
1.4.1 REGIONS COVERED 25
1.4.2 YEARS CONSIDERED 26
1.5 CURRENCY CONSIDERED 26
1.6 LIMITATIONS 26
1.7 STAKEHOLDERS 27
1.8 SUMMARY OF CHANGES 27

2 RESEARCH METHODOLOGY 28

2.1 RESEARCH DATA 28
・ FIGURE 2 SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET: RESEARCH DESIGN 28
2.1.1 SECONDARY DATA 29
2.1.2 PRIMARY DATA 29
2.1.2.1 PRIMARY DATA SOURCES 29
2.1.2.2 PRIMARY INTERVIEWS - TOP SEMICONDUCTOR & IC PACKAGING MATERIAL MANUFACTURERS 30
2.1.2.3 BREAKDOWN OF PRIMARY INTERVIEWS 30
2.1.2.4 KEY INDUSTRY INSIGHTS 30
2.2 BASE NUMBER CALCULATION 31
2.2.1 SUPPLY-SIDE APPROACH 31
2.2.2 DEMAND-SIDE APPROACH 31
2.3 FORECAST NUMBER CALCULATION 31
2.3.1 SUPPLY SIDE 31
2.3.2 DEMAND SIDE 32
2.4 MARKET SIZE ESTIMATION 32
・ FIGURE 3 MARKET SIZE ESTIMATION METHODOLOGY: REVENUE OF MARKET PLAYERS 32
2.4.1 BOTTOM-UP APPROACH 33
2.4.2 TOP-DOWN APPROACH 33
2.5 DATA TRIANGULATION 34
・ FIGURE 4 SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET: DATA TRIANGULATION 34
2.6 RESEARCH ASSUMPTIONS 35
2.7 IMPACT OF RECESSION 35
2.8 GROWTH FORECAST 36
2.9 RISK ASSESSMENT 36

3 EXECUTIVE SUMMARY 37

・ FIGURE 5 ORGANIC SUBSTRATE TYPE SEGMENT TO DOMINATE MARKET BETWEEN 2024 AND 2029 37
・ FIGURE 6 CONSUMER ELECTRONICS END-USE INDUSTRY TO LEAD MARKET BETWEEN 2024 AND 2029 38
・ FIGURE 7 SOP PACKAGING TECHNOLOGY TO LEAD MARKET BETWEEN 2024 AND 2029 39
・ FIGURE 8 ASIA PACIFIC TO DOMINATE MARKET DURING FORECAST PERIOD 40

4 PREMIUM INSIGHTS 41

4.1 ATTRACTIVE OPPORTUNITIES FOR PLAYERS IN SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET 41
・ FIGURE 9 GROWING DEMAND FROM AUTOMOTIVE AND IT & TELECOMMUNICATION SECTORS TO DRIVE MARKET 41
4.2 SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY TYPE 42
・ FIGURE 10 ORGANIC SUBSTRATES TO BE FASTEST-GROWING SEGMENT DURING FORECAST PERIOD 42
・ FIGURE 11 CONSUMER ELECTRONICS TO BE FASTEST-GROWING SEGMENT DURING FORECAST PERIOD 42
・ FIGURE 12 SOP TO BE FASTEST-GROWING SEGMENT DURING FORECAST PERIOD 43
4.3 SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY COUNTRY 43
・ FIGURE 13 INDIA TO BE FASTEST-GROWING MARKET DURING FORECAST PERIOD 43

5 MARKET OVERVIEW 44

5.1 INTRODUCTION 44
5.2 MARKET DYNAMICS 45
・ FIGURE 14 DRIVERS, RESTRAINTS, OPPORTUNITIES, AND CHALLENGES IN SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET 45
5.2.1 DRIVERS 45
5.2.1.1 INCREASING DEMAND FROM CONSUMER ELECTRONICS MARKET 45
5.2.1.2 GROWING MINIATURIZATION AND DENSIFICATION IN ELECTRONICS SECTOR 46
5.2.1.3 ADOPTION OF EMERGING TECHNOLOGIES LIKE 5G AND AUTONOMOUS VEHICLES 47
5.2.2 RESTRAINTS 48
5.2.2.1 IP CONCERNS IN SEMICONDUCTOR INDUSTRY DURING OUTSOURCING AND TESTING PROCESSES 48
5.2.2.2 TECHNOLOGICAL CHANGE AND OBSOLESCENCE 48
5.2.3 OPPORTUNITIES 49
5.2.3.1 INTEGRATION WITH ADVANCED TECHNOLOGIES 49
5.2.3.2 NEED FOR CUSTOMIZATION AND SPECIALIZATION IN ELECTRONICS INDUSTRY 49
5.2.4 CHALLENGES 50
5.2.4.1 HIGH COST OF ADVANCED MATERIALS 50
5.2.4.2 STRINGENT REGULATIONS AND SUSTAINABILITY FACTOR 51

5.3 TRENDS/DISRUPTIONS IMPACTING CUSTOMER BUSINESS 51
5.3.1 REVENUE SHIFT AND NEW REVENUE POCKETS FOR SEMICONDUCTOR & IC PACKAGING MATERIAL MANUFACTURERS 51
・ FIGURE 15 REVENUE SHIFT OF SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET 52
5.4 VALUE CHAIN ANALYSIS 52
・ FIGURE 16 OVERVIEW OF SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET VALUE CHAIN 53
5.4.1 RAW MATERIAL SUPPLIERS 53
5.4.2 MANUFACTURING 53
5.4.3 DISTRIBUTION AND LOGISTICS 54
5.4.4 END USERS 54
5.5 INVESTMENT AND FUNDING 54
・ FIGURE 17 INVESTMENT AND FUNDING SCENARIO: SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET 54
5.6 PRICING ANALYSIS 55
5.6.1 AVERAGE SELLING PRICE TREND OF CERAMIC PACKAGES, BY REGION 55
・ TABLE 1 AVERAGE SELLING PRICE OF CERAMIC PACKAGES, BY REGION, 2020–2029 (USD/PIECE) 55
・ FIGURE 18 SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET: AVERAGE SELLING PRICE TREND OF CERAMIC PACKAGES, BY REGION 55
5.6.2 AVERAGE SELLING PRICE TREND OF ENCAPSULATION RESINS, BY REGION 56
・ TABLE 2 AVERAGE SELLING PRICE OF ENCAPSULATION RESINS, BY REGION, 2020–2029 (USD/KG) 56
・ FIGURE 19 SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET: AVERAGE SELLING PRICE TREND OF ENCAPSULATION RESINS, BY REGION 56
5.6.3 AVERAGE SELLING PRICE TREND OF LEADFRAMES, BY REGION 57
・ TABLE 3 AVERAGE SELLING PRICE OF LEADFRAMES, BY REGION, 2020–2029 (USD/PIECE) 57
・ FIGURE 20 SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET: AVERAGE SELLING PRICE TREND OF LEADFRAMES, BY REGION 57
5.6.4 AVERAGE SELLING PRICE TREND OF SOLDER BALLS, BY REGION 57
・ TABLE 4 AVERAGE SELLING PRICE OF SOLDER BALLS, BY REGION, 2020–2029 (USD/BALL) 57
・ FIGURE 21 SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET: AVERAGE SELLING PRICE TREND OF SOLDER BALLS, BY REGION 58
5.7 ECOSYSTEM MAP 58
・ TABLE 5 SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET: ECOSYSTEM 58
5.8 TECHNOLOGY ANALYSIS 59
・ TABLE 6 TECHNOLOGIES OFFERED IN SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET 60
5.9 PATENT ANALYSIS 61
5.9.1 METHODOLOGY 61
5.9.2 PATENTS GRANTED WORLDWIDE, 2014–2023 61
・ TABLE 7 SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET: TOTAL NUMBER OF PATENTS 61
5.9.3 PATENT PUBLICATION TRENDS 62
・ FIGURE 22 NUMBER OF PATENTS GRANTED (2014−2023) 62
5.9.4 INSIGHTS 62
5.9.5 LEGAL STATUS OF PATENTS 63
・ FIGURE 23 SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET: LEGAL STATUS OF PATENTS 63
5.9.6 JURISDICTION ANALYSIS 63
・ FIGURE 24 PATENTS ANALYSIS FOR SEMICONDUCTOR & IC PACKAGING MATERIALS, BY JURISDICTION, 2014−2023 63
5.9.7 TOP COMPANIES/APPLICANTS 64
・ FIGURE 25 TOP 10 COMPANIES WITH HIGHEST NUMBER OF PATENTS IN LAST 10 YEARS 64
・ TABLE 8 LIST OF MAJOR PATENT OWNERS FOR SEMICONDUCTOR & IC PACKAGING MATERIALS 64
5.9.8 LIST OF MAJOR PATENTS 65
・ TABLE 9 MAJOR PATENTS FOR SEMICONDUCTOR & IC PACKAGING MATERIALS 65
5.10 TRADE ANALYSIS 66
5.10.1 IMPORT SCENARIO 66
・ FIGURE 26 IMPORTS OF SEMICONDUCTOR & IC PACKAGING MATERIALS, BY COUNTRY, 2020–2023 (USD THOUSAND) 66
5.10.2 EXPORT SCENARIO 67
・ FIGURE 27 EXPORTS OF SEMICONDUCTOR & IC PACKAGING MATERIALS, BY COUNTRY, 2020–2023 (USD THOUSAND) 67
5.11 KEY CONFERENCES & EVENTS, 2024–2025 67
・ TABLE 10 SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET: DETAILED LIST OF CONFERENCES AND EVENTS 67
5.12 REGULATORY LANDSCAPE 68
5.12.1 REGULATORY BODIES, GOVERNMENT AGENCIES, AND OTHER ORGANIZATIONS 68
・ TABLE 11 NORTH AMERICA: LIST OF REGULATORY BODIES, GOVERNMENT AGENCIES, AND OTHER ORGANIZATIONS 68
・ TABLE 12 EUROPE: LIST OF REGULATORY BODIES, GOVERNMENT AGENCIES, AND OTHER ORGANIZATIONS 69
・ TABLE 13 ASIA PACIFIC: LIST OF REGULATORY BODIES, GOVERNMENT AGENCIES, AND OTHER ORGANIZATIONS 70
・ TABLE 14 MIDDLE EAST & AFRICA: LIST OF REGULATORY BODIES, GOVERNMENT AGENCIES, AND OTHER ORGANIZATIONS 71
・ TABLE 15 SOUTH AMERICA: LIST OF REGULATORY BODIES, GOVERNMENT AGENCIES, AND OTHER ORGANIZATIONS 72
5.12.2 REGULATIONS RELATED TO SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET 73
・ TABLE 16 LIST OF REGULATIONS FOR SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET 73
5.13 PORTER’S FIVE FORCES ANALYSIS 73
・ TABLE 17 SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET: PORTER'S FIVE FORCES ANALYSIS 73
・ FIGURE 28 PORTER’S FIVE FORCES ANALYSIS: SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET 74
5.13.1 THREAT OF SUBSTITUTES 74
5.13.2 THREAT OF NEW ENTRANTS 75
5.13.3 BARGAINING POWER OF SUPPLIERS 75
5.13.4 BARGAINING POWER OF BUYERS 76
5.13.5 INTENSITY OF COMPETITIVE RIVALRY 76
5.14 KEY STAKEHOLDERS AND BUYING CRITERIA 77
5.14.1 KEY STAKEHOLDERS IN BUYING PROCESS 77
・ FIGURE 29 INFLUENCE OF STAKEHOLDERS ON BUYING PROCESS FOR TOP THREE APPLICATIONS 77
・ TABLE 18 INFLUENCE OF INSTITUTIONAL BUYERS ON BUYING PROCESS FOR TOP THREE APPLICATIONS 77
5.14.2 BUYING CRITERIA 77
・ FIGURE 30 KEY BUYING CRITERIA FOR APPLICATIONS 78
・ TABLE 19 KEY BUYING CRITERIA FOR APPLICATIONS 78
5.15 MACROECONOMIC INDICATORS 79
5.15.1 GDP TRENDS AND FORECASTS OF MAJOR ECONOMIES 79
5.16 CASE STUDIES 79
5.16.1 AMKOR’S CONTRIBUTION TO ADVANCING AUTOMOTIVE SEMICONDUCTOR SOLUTIONS 79
5.16.2 BOLSTERING SEMICONDUCTOR PACKAGING IN US: IMPERATIVE OF NATIONAL ADVANCED PACKAGING MANUFACTURING PROGRAM 80
5.16.3 ADVANCING WEARABLE SENSOR TECHNOLOGY: ROLE OF MASTER BOND EP17HTDA-1 DIE ATTACH ADHESIVE IN INTEGRATING ADVANCED SENSOR COMPONENTS 81

6 SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY TYPE 82

6.1 INTRODUCTION 83
・ FIGURE 31 ORGANIC SUBSTRATE TO BE LARGEST SEGMENT OF SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET DURING FORECAST PERIOD 83
・ TABLE 21 SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY TYPE, 2020–2023 (USD MILLION) 83
・ TABLE 22 SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY TYPE, 2024–2029 (USD MILLION) 84
6.2 ORGANIC SUBSTRATES 84
6.2.1 COMPLEX NEEDS OF MODERN ELECTRONIC SEGMENT TO DRIVE GROWTH 84
6.3 BONDING WIRES 85
6.3.1 VITAL FUNCTIONALITY AND ADVANCEMENTS IN BONDING WIRES TO DRIVE MARKET 85
6.4 LEADFRAMES 86
6.4.1 INCREASE IN NEED FOR THERMALLY EFFICIENT MATERIALS FOR SEMICONDUCTORS TO DRIVE DEMAND 86
6.5 ENCAPSULATION RESINS 86
6.5.1 SUPERIOR ELECTRICAL INSULATION, CHEMICAL RESISTANCE, AND MECHANICAL STRENGTH TO DRIVE DEMAND 86
6.6 DIE ATTACH MATERIALS 87
6.6.1 VERSATILITY IN VARIOUS DEVICES FOR MULTIPLE USES TO DRIVE DEMAND 87
6.7 CERAMIC PACKAGES 87
6.7.1 INCREASED USE OF MINIATURIZATION IN ELECTRONICS INDUSTRY TO DRIVE DEMAND 87
6.8 THERMAL INTERFACE MATERIALS 88
6.8.1 INCREASED COMPLEXITY IN ELECTRONIC PRODUCTS TO DRIVE DEMAND 88
6.9 SOLDER BALLS 88
6.9.1 DEMAND FOR COMPACT, EFFICIENT, AND HIGH-PERFORMING DEVICES TO DRIVE MARKET 88
6.10 OTHER TYPES 89

7 SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY PACKAGING TECHNOLOGY 90

7.1 INTRODUCTION 91
・ FIGURE 32 SOP SEGMENT TO LEAD MARKET DURING FORECAST PERIOD 91
・ TABLE 23 SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY PACKAGING TECHNOLOGY, 2020–2023 (USD MILLION) 92
・ TABLE 24 SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY PACKAGING TECHNOLOGY, 2024–2029 (USD MILLION) 92
7.2 SMALL OUTLINE PACKAGE (SOP) 92
7.2.1 COMPACT, LOW-PROFILE HIGH-PERFORMANCE PACKAGING SOLUTION FOR WIDE RANGE OF ELECTRONIC APPLICATIONS 92
7.3 GRID ARRAY (GA) 93
7.3.1 REDUCTION IN SIGNAL PROPAGATION DELAYS, IMPROVED SIGNAL INTEGRITY, AND ENHANCED SYSTEM PERFORMANCE TO DRIVE MARKET 93
7.4 QUAD FLAT NO-LEADS (QFN) 94
7.4.1 COMPACTNESS, THERMAL EFFICIENCY, ELECTRICAL PERFORMANCE & RELIABILITY MAKE IT PREFERRED CHOICE FOR HIGH DENSITY ELECTRONIC APPLICATIONS 94
7.5 DUAL FLAT NO-LEADS (DFN) 94
7.5.1 COMPACT, COST-EFFECTIVE, AND THERMALLY EFFICIENT SOLUTIONS FOR SPACE-CONSTRAINED ELECTRONIC APPLICATIONS 94
7.6 QUAD FLAT PACKAGES (QFP) 95
7.6.1 HIGH PIN COUNT, IMPROVED THERMAL PERFORMANCE, AND SUITABILITY FOR AUTOMATED ASSEMBLY MAKE IT PREFERRED CHOICE 95
7.7 DUAL IN-LINE (DIP) 96
7.7.1 ROBUSTNESS, SIMPLICITY, AND EASE OF APPLICATION TO DRIVE DEMAND 96
7.8 OTHER TECHNOLOGIES 97
7.8.1 CHIP SCALE PACKAGE (CSP) 97
7.8.2 WAFER LEVEL PACKAGING (WLP) 97
7.8.3 SYSTEM IN PACKAGE (SIP) 97

8 SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY END-USE INDUSTRY 98

8.1 INTRODUCTION 99
・ FIGURE 33 CONSUMER ELECTRONICS TO DOMINATE MARKET DURING FORECAST PERIOD (USD MILLION) 99
・ TABLE 25 SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY END-USE INDUSTRY, 2020–2023 (USD MILLION) 99
・ TABLE 26 SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY END-USE INDUSTRY, 2024–2029 (USD MILLION) 100
8.2 CONSUMER ELECTRONICS 100
8.2.1 INCREASE IN DEMAND FOR ADVANCED PACKAGING SOLUTIONS TO DRIVE MARKET 100
8.3 AUTOMOTIVE 101
8.3.1 RISE IN DEMAND FOR EVS TO DRIVE MARKET FOR SEMICONDUCTOR & IC PACKAGING MATERIALS 101
8.4 HEALTHCARE 101
8.4.1 DEMAND FOR BIOCOMPATIBILITY, PRECISION, AND RELIABILITY TO DRIVE MARKET 101
8.5 IT & TELECOMMUNICATION 102
8.5.1 SEMICONDUCTOR & IC PACKAGING MATERIALS TO PLAY VITAL ROLE IN MEETING DEMANDS FOR FASTER AND MORE EFFICIENT IT & TELECOMMUNICATIONS SYSTEMS 102
8.6 AEROSPACE & DEFENSE 102
8.6.1 DEMAND FOR LIGHTWEIGHT AND HIGH-PERFORMANCE PACKAGING SOLUTIONS TO DRIVE MARKET 102
8.7 OTHER END-USE INDUSTRIES 103

9 SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY REGION 104

9.1 INTRODUCTION 105
・ FIGURE 34 ASIA PACIFIC TO BE FASTEST-GROWING MARKET DURING FORECAST PERIOD 105
・ TABLE 27 SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY REGION, 2020–2023 (USD MILLION) 106
・ TABLE 28 SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY REGION, 2024–2029 (USD MILLION) 106
9.2 ASIA PACIFIC 106
9.2.1 RECESSION IMPACT 107
・ FIGURE 35 ASIA PACIFIC: SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SNAPSHOT 107
・ TABLE 29 ASIA PACIFIC: SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY COUNTRY, 2020–2023 (USD MILLION) 108
・ TABLE 30 ASIA PACIFIC: SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY COUNTRY, 2024–2029 (USD MILLION) 108
・ TABLE 31 ASIA PACIFIC: SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY TYPE, 2020–2023 (USD MILLION) 109
・ TABLE 32 ASIA PACIFIC: SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY TYPE, 2024–2029 (USD MILLION) 109
・ TABLE 33 ASIA PACIFIC: SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY PACKAGING TECHNOLOGY, 2020–2023 (USD MILLION) 110
・ TABLE 34 ASIA PACIFIC: SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY PACKAGING TECHNOLOGY, 2024–2029 (USD MILLION) 110
・ TABLE 35 ASIA PACIFIC: SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY END-USE INDUSTRY, 2020–2023 (USD MILLION) 111
・ TABLE 36 ASIA PACIFIC: SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY END-USE INDUSTRY, 2024–2029 (USD MILLION) 111
9.2.2 CHINA 111
9.2.2.1 PUSH TOWARD ELECTRIC VEHICLES AND GOVERNMENT SUPPORT FOR DOMESTIC SEMICONDUCTOR DEVELOPMENT TO DRIVE MARKET 111
・ TABLE 37 CHINA: SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY END-USE INDUSTRY, 2020–2023 (USD MILLION) 112
・ TABLE 38 CHINA: SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY END-USE INDUSTRY, 2024–2029 (USD MILLION) 112
9.2.3 JAPAN 113
9.2.3.1 FOCUS ON HIGH-END TECHNOLOGY TO DRIVE MARKET 113
・ TABLE 39 JAPAN: SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY END-USE INDUSTRY, 2020–2023 (USD MILLION) 114
・ TABLE 40 JAPAN: SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY END-USE INDUSTRY, 2024–2029 (USD MILLION) 114
9.2.4 INDIA 114
9.2.4.1 GROWING AUTOMOTIVE AND CONSUMER ELECTRONICS INDUSTRY COUPLED WITH EXTENSIVE GOVERNMENT INITIATIVES TO DRIVE MARKET 114
・ TABLE 41 INDIA: SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY END-USE INDUSTRY, 2020–2023 (USD MILLION) 115
・ TABLE 42 INDIA: SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY END-USE INDUSTRY, 2024–2029 (USD MILLION) 115
9.2.5 SOUTH KOREA 116
9.2.5.1 TECHNOLOGICAL PROWESS AND THRIVING CONSUMER ELECTRONICS INDUSTRY TO DRIVE MARKET 116
・ TABLE 43 SOUTH KOREA: SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY END-USE INDUSTRY, 2020–2023 (USD MILLION) 116
・ TABLE 44 SOUTH KOREA: SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY END-USE INDUSTRY, 2024–2029 (USD MILLION) 116
9.2.6 TAIWAN 117
9.2.6.1 EFFICIENT MANUFACTURING CAPABILITIES, GOVERNMENT SUPPORT, AND FOCUS ON TECHNOLOGY AND INNOVATION TO DRIVE DEMAND 117
・ TABLE 45 TAIWAN: SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY END-USE INDUSTRY, 2020–2023 (USD MILLION) 117
・ TABLE 46 TAIWAN: SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY END-USE INDUSTRY, 2024–2029 (USD MILLION) 118
9.2.7 REST OF ASIA PACIFIC 118
・ TABLE 47 REST OF ASIA PACIFIC: SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY END-USE INDUSTRY, 2020–2023 (USD MILLION) 118
・ TABLE 48 REST OF ASIA PACIFIC: SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY END-USE INDUSTRY, 2024–2029 (USD MILLION) 119
9.3 NORTH AMERICA 119
9.3.1 RECESSION IMPACT 119
・ FIGURE 36 NORTH AMERICA: SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SNAPSHOT 120
・ TABLE 49 NORTH AMERICA: SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY COUNTRY, 2020–2023(USD MILLION) 120
・ TABLE 50 NORTH AMERICA: SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY COUNTRY, 2024–2029 (USD MILLION) 121
・ TABLE 51 NORTH AMERICA: SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY TYPE, 2020–2023 (USD MILLION) 121
・ TABLE 52 NORTH AMERICA: SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY TYPE, 2024–2029 (USD MILLION) 121
・ TABLE 53 NORTH AMERICA: SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY PACKAGING TECHNOLOGY, 2020–2023 (USD MILLION) 122
・ TABLE 54 NORTH AMERICA: SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY PACKAGING TECHNOLOGY, 2024–2029 (USD MILLION) 122
・ TABLE 55 NORTH AMERICA: SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY END-USE INDUSTRY, 2020–2023 (USD MILLION) 122
・ TABLE 56 NORTH AMERICA: SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY END-USE INDUSTRY, 2024–2029 (USD MILLION) 123
9.3.2 US 123
9.3.2.1 GROWTH OF AUTOMOTIVE ELECTRONICS AND GOVERNMENT INITIATIVES TO DRIVE DEMAND 123
・ TABLE 57 US: SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY END-USE INDUSTRY, 2020–2023 (USD MILLION) 124
・ TABLE 58 US: SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY END-USE INDUSTRY, 2024–2029 (USD MILLION) 124
9.3.3 CANADA 124
9.3.3.1 FOCUS ON HIGH-RELIABILITY SOLUTIONS TO DRIVE MARKET 124
・ TABLE 59 CANADA: SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY END-USE INDUSTRY, 2020–2023 (USD MILLION) 125
・ TABLE 60 CANADA: SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY END-USE INDUSTRY, 2024–2029 (USD MILLION) 125
9.3.4 MEXICO 125
9.3.4.1 THRIVING CONSUMER ELECTRONICS AND AUTOMOTIVE MANUFACTURING SECTORS TO DRIVE DEMAND 125
・ TABLE 61 MEXICO: SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY END-USE INDUSTRY, 2020–2023 (USD MILLION) 126
・ TABLE 62 MEXICO: SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY END-USE INDUSTRY, 2024–2029 (USD MILLION) 126
9.4 EUROPE 127
9.4.1 RECESSION IMPACT 127
・ FIGURE 37 EUROPE: SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET SNAPSHOT 128
・ TABLE 63 EUROPE: SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY COUNTRY, 2020–2023 (USD MILLION) 129
・ TABLE 64 EUROPE: SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY COUNTRY, 2024–2029 (USD MILLION) 129
・ TABLE 65 EUROPE: SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY TYPE, 2020–2023 (USD MILLION) 130
・ TABLE 66 EUROPE: SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY TYPE, 2024–2029 (USD MILLION) 130
・ TABLE 67 EUROPE: SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY PACKAGING TECHNOLOGY, 2020–2023 (USD MILLION) 131
・ TABLE 68 EUROPE: SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY PACKAGING TECHNOLOGY, 2024–2029 (USD MILLION) 131
・ TABLE 69 EUROPE: SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY END-USE INDUSTRY, 2020–2023 (USD MILLION) 131
・ TABLE 70 EUROPE: SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY END-USE INDUSTRY, 2024–2029 (USD MILLION) 132
9.4.2 GERMANY 132
9.4.2.1 GROWTH OF AUTOMOTIVE, PHARMACEUTICAL, AND INDUSTRIAL AUTOMATION SECTORS TO DRIVE DEMAND 132
・ TABLE 71 GERMANY: SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY END-USE INDUSTRY, 2020–2023 (USD MILLION) 133
・ TABLE 72 GERMANY: SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY END-USE INDUSTRY, 2024–2029 (USD MILLION) 133
9.4.3 ITALY 133
9.4.3.1 ESTABLISHED MANUFACTURING EXPERTISE ALONG WITH GOVERNMENT INCENTIVES TO DRIVE MARKET 133
・ TABLE 73 ITALY: SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY END-USE INDUSTRY, 2020–2023 (USD MILLION) 134
・ TABLE 74 ITALY: SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY END-USE INDUSTRY, 2024–2029 (USD MILLION) 134
9.4.4 FRANCE 135
9.4.4.1 GROWTH IN AEROSPACE & DEFENSE SECTOR TO DRIVE MARKET 135
・ TABLE 75 FRANCE: SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY END-USE INDUSTRY, 2020–2023 (USD MILLION) 135
・ TABLE 76 FRANCE: SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY END-USE INDUSTRY, 2024–2029 (USD MILLION) 136
9.4.5 UK 136
9.4.5.1 KEY FOCUS ON NICHE AND GROWING END-USE INDUSTRIES TO DRIVE DEMAND 136
・ TABLE 77 UK: SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY END-USE INDUSTRY, 2020–2023 (USD MILLION) 137
・ TABLE 78 UK: SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY END-USE INDUSTRY, 2024–2029 (USD MILLION) 137
9.4.6 SPAIN 137
9.4.6.1 MANUFACTURING SECTOR, ALONG WITH GOVERNMENT’S FOCUS ON RESEARCH & DEVELOPMENT, TO DRIVE DEMAND 137
・ TABLE 79 SPAIN: SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY END-USE INDUSTRY, 2020–2023 (USD MILLION) 138
・ TABLE 80 SPAIN: SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY END-USE INDUSTRY, 2024–2029 (USD MILLION) 138
9.4.7 REST OF EUROPE 138
・ TABLE 81 REST OF EUROPE: SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY END-USE INDUSTRY, 2020–2023 (USD MILLION) 139
・ TABLE 82 REST OF EUROPE: SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY END-USE INDUSTRY, 2024–2029 (USD MILLION) 139
9.5 MIDDLE EAST & AFRICA 139
9.5.1 RECESSION IMPACT 140
・ TABLE 83 MIDDLE EAST & AFRICA: SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY COUNTRY, 2020–2023 (USD MILLION) 140
・ TABLE 84 MIDDLE EAST & AFRICA: SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY COUNTRY, 2024–2029 (USD MILLION) 140
・ TABLE 85 MIDDLE EAST & AFRICA: SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY TYPE, 2020–2023 (USD MILLION) 141
・ TABLE 86 MIDDLE EAST & AFRICA: SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY TYPE, 2024–2029 (USD MILLION) 141
・ TABLE 87 MIDDLE EAST & AFRICA: SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY PACKAGING TECHNOLOGY, 2020–2023 (USD MILLION) 142
・ TABLE 88 MIDDLE EAST & AFRICA: SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY PACKAGING TECHNOLOGY, 2024–2029 (USD MILLION) 142
・ TABLE 89 MIDDLE EAST & AFRICA: SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY END-USE INDUSTRY, 2020–2023 (USD MILLION) 142
・ TABLE 90 MIDDLE EAST & AFRICA: SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY END-USE INDUSTRY, 2024–2029 (USD MILLION) 143
9.5.2 UAE 143
9.5.2.1 COMMITMENT TO STRATEGIC DIVERSIFICATION AND GOVERNMENT INITIATIVES TO DRIVE DEMAND 143
・ TABLE 91 UAE: SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY END-USE INDUSTRY, 2020–2023 (USD MILLION) 144
・ TABLE 92 UAE: SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY END-USE INDUSTRY, 2024–2029 (USD MILLION) 144
9.5.3 REST OF GCC COUNTRIES 144
・ TABLE 93 REST OF GCC COUNTRIES: SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY END-USE INDUSTRY, 2020–2023 (USD MILLION) 145
・ TABLE 94 REST OF GCC COUNTRIES: SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY END-USE INDUSTRY, 2024–2029 (USD MILLION) 145
9.5.4 ISRAEL 145
9.5.4.1 PROMINENT HIGH-TECH COMMUNICATION SECTOR COUPLED WITH THRIVING STARTUP ECOSYSTEM TO DRIVE DEMAND 145
・ TABLE 95 ISRAEL: SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY END-USE INDUSTRY, 2020–2023 (USD MILLION) 146
・ TABLE 96 ISRAEL: SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY END-USE INDUSTRY, 2024–2029 (USD MILLION) 146
9.5.5 SOUTH AFRICA 146
9.5.5.1 AUTOMOTIVE ELECTRONICS SECTOR TO DRIVE DEMAND 146
・ TABLE 97 SOUTH AFRICA: SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY END-USE INDUSTRY, 2020–2023 (USD MILLION) 147
・ TABLE 98 SOUTH AFRICA: SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY END-USE INDUSTRY, 2024–2029 (USD MILLION) 147
9.5.6 REST OF MIDDLE EAST & AFRICA 147
・ TABLE 99 REST OF MIDDLE EAST & AFRICA: SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY END-USE INDUSTRY, 2020–2023 (USD MILLION) 148
・ TABLE 100 REST OF MIDDLE EAST & AFRICA: SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY END-USE INDUSTRY, 2024–2029 (USD MILLION) 148
9.6 SOUTH AMERICA 148
9.6.1 RECESSION IMPACT 149
・ TABLE 101 SOUTH AMERICA: SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY COUNTRY, 2020–2023(USD MILLION) 149
・ TABLE 102 SOUTH AMERICA: SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY COUNTRY, 2024–2029 (USD MILLION) 149
・ TABLE 103 SOUTH AMERICA: SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY TYPE, 2020–2023 (USD MILLION) 150
・ TABLE 104 SOUTH AMERICA: SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY TYPE, 2024–2029 (USD MILLION) 150
・ TABLE 105 SOUTH AMERICA: SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY PACKAGING TECHNOLOGY, 2020–2023 (USD MILLION) 151
・ TABLE 106 SOUTH AMERICA: SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY PACKAGING TECHNOLOGY, 2024–2029 (USD MILLION) 151
・ TABLE 107 SOUTH AMERICA: SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY END-USE INDUSTRY, 2020–2023 (USD MILLION) 151
・ TABLE 108 SOUTH AMERICA: SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY END-USE INDUSTRY, 2024–2029 (USD MILLION) 152
9.6.2 ARGENTINA 152
9.6.2.1 GOVERNMENT INCENTIVES AND POLICIES TO ATTRACT FOREIGN INVESTMENT TO DRIVE DEMAND 152
・ TABLE 109 ARGENTINA: SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY END-USE INDUSTRY, 2020–2023 (USD MILLION) 152
・ TABLE 110 ARGENTINA: SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY END-USE INDUSTRY, 2024–2029 (USD MILLION) 153
9.6.3 BRAZIL 153
9.6.3.1 THRIVING ELECTRONICS SECTOR ALONG WITH GOVERNMENT INITIATIVES ATTRACTING FOREIGN INVESTMENTS TO SUPPORT MARKET GROWTH 153
・ TABLE 111 BRAZIL: SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY END-USE INDUSTRY, 2020–2023 (USD MILLION) 154
・ TABLE 112 BRAZIL: SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY END-USE INDUSTRY, 2024–2029 (USD MILLION) 154
9.6.4 REST OF SOUTH AMERICA 154
・ TABLE 113 REST OF SOUTH AMERICA: SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY END-USE INDUSTRY, 2020–2023 (USD MILLION) 155
・ TABLE 114 REST OF SOUTH AMERICA: SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, BY END-USE INDUSTRY, 2024–2029 (USD MILLION) 155

10 COMPETITIVE LANDSCAPE 156

10.1 INTRODUCTION 156
10.1.1 OVERVIEW OF STRATEGIES ADOPTED BY KEY SEMICONDUCTOR & IC PACKAGING MANUFACTURERS 156
10.2 MARKET SHARE ANALYSIS 157
10.2.1 RANKING OF KEY MARKET PLAYERS, 2022 157
・ FIGURE 38 RANKING OF TOP FIVE PLAYERS IN SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, 2022 157
10.2.2 MARKET SHARE OF KEY PLAYERS 158
・ TABLE 115 SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET: DEGREE OF COMPETITION 158
10.2.3 BRAND/PRODUCT COMPARATIVE ANALYSIS 159
・ FIGURE 39 BRAND/PRODUCT COMPARATIVE ANALYSIS, BY SEGMENTS 159
・ FIGURE 40 SHARE OF KEY PLAYERS IN SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET, 2022 160
10.2.3.1 JIANGSU CHANGJIAN TECHNOLOGY CO., LTD. 160
10.2.3.2 HENKEL AG & CO. KGAA 160
10.2.3.3 AMKOR TECHNOLOGY 160
10.2.3.4 ASE 161
10.2.3.5 SILICONWARE PRECISION INDUSTRIES CO., LTD. (SPIL) 161
10.3 REVENUE ANALYSIS 162
・ FIGURE 41 REVENUE ANALYSIS OF TOP 5 PLAYERS, 2020–2024 162
10.4 COMPANY EVALUATION MATRIX: KEY PLAYERS, 2023 162
10.4.1 STARS 162
10.4.2 EMERGING LEADERS 163
10.4.3 PERVASIVE PLAYERS 163
10.4.4 PARTICIPANTS 163
・ FIGURE 42 SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET: COMPANY EVALUATION MATRIX, 2023 163
10.4.5 COMPANY FOOTPRINT: KEY PLAYERS, 2023 164
・ TABLE 116 COMPANY TYPE FOOTPRINT (10 COMPANIES) 164
・ TABLE 117 COMPANY END-USE INDUSTRY FOOTPRINT (10 COMPANIES) 165
・ TABLE 118 COMPANY PACKAGING TECHNOLOGY FOOTPRINT (10 COMPANIES) 165
・ TABLE 119 COMPANY REGION FOOTPRINT (10 COMPANIES) 166
10.5 COMPANY EVALUATION MATRIX: STARTUPS/SMES, 2023 166
10.5.1 PROGRESSIVE COMPANIES 166
10.5.2 RESPONSIVE COMPANIES 166
10.5.3 DYNAMIC COMPANIES 167
10.5.4 STARTING BLOCKS 167
・ FIGURE 43 SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET: START-UPS/SMES EVALUATION MATRIX, 2023 167
10.5.5 COMPETITIVE BENCHMARKING 168
10.5.5.1 DETAILED LIST OF KEY START-UPS/SMES 168
・ TABLE 120 SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET: DETAILED LIST OF KEY START-UPS/SMES 168
10.5.5.2 COMPETITIVE BENCHMARKING OF KEY START-UPS/SMES 169
・ TABLE 121 START-UPS/SMES TYPE FOOTPRINT (15 COMPANIES) 169
・ TABLE 122 START-UPS/SMES END-USE INDUSTRY FOOTPRINT (15 COMPANIES) 170
・ TABLE 123 START-UPS/SMES PACKAGING TECHNOLOGY FOOTPRINT (15 COMPANIES) 171
・ TABLE 124 START-UPS/SMES REGION FOOTPRINT (15 COMPANIES) 172
・ FIGURE 44 SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET: OVERALL FOOTPRINT 173
10.5.6 VALUATION AND FINANCIAL METRICS OF KEY SEMICONDUCTOR & IC PACKAGING VENDORS 174
・ FIGURE 45 EV/EBITDA OF KEY VENDORS 174
・ FIGURE 46 YEAR-TO-DATE (YTD) PRICE TOTAL RETURN 174
10.6 COMPETITIVE SCENARIO AND TRENDS 175
10.6.1 PRODUCT LAUNCHES 175
・ TABLE 125 SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET: PRODUCT LAUNCHES, JANUARY 2019–FEBRUARY 2024 175
10.6.2 DEALS 177
・ TABLE 126 SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET: DEALS, JANUARY 2019–FEBRUARY 2024 177
10.6.3 EXPANSIONS 178
・ TABLE 127 SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET: EXPANSIONS, JANUARY 2019–FEBRUARY 2024 178

11 COMPANY PROFILES 180

(BUSINESS OVERVIEW, PRODUCTS OFFERED, RECENT DEVELOPMENTS & MNM VIEW)*
11.1 KEY PLAYERS 180
11.1.1 LG CHEM. 180
・ TABLE 128 LG CHEM.: COMPANY OVERVIEW 180
・ FIGURE 47 LG CHEM.: COMPANY SNAPSHOT 181
・ TABLE 129 LG CHEM.: PRODUCT OFFERINGS 181
・ TABLE 130 LG CHEM.: DEALS, 2020–2024 182
・ TABLE 131 LG CHEM.: OTHERS, 2020–2024 182
11.1.2 JIANGSU CHANGJIAN TECHNOLOGY CO., LTD. 184
・ TABLE 132 JIANGSU CHANGJIAN TECHNOLOGY CO., LTD.: COMPANY OVERVIEW 184
・ FIGURE 48 JIANGSU CHANGJIAN TECHNOLOGY CO., LTD.: COMPANY SNAPSHOT 184
・ TABLE 133 JIANGSU CHANGJIAN TECHNOLOGY CO., LTD.: PRODUCT OFFERINGS 185
・ TABLE 134 JIANGSU CHANGJIAN TECHNOLOGY CO., LTD.: PRODUCT LAUNCHES, 2020–2024 186
・ TABLE 135 JIANGSU CHANGJIAN TECHNOLOGY CO., LTD.: OTHER DEVELOPMENTS, 2020–2024 186
11.1.3 HENKEL AG & CO. KGAA 188
・ TABLE 136 HENKEL AG & CO. KGAA: COMPANY OVERVIEW 188
・ FIGURE 49 HENKEL AG & CO. KGAA: COMPANY SNAPSHOT 189
・ TABLE 137 HENKEL AG & CO. KGAA: PRODUCT OFFERINGS 189
・ TABLE 138 HENKEL AG & CO. KGAA: PRODUCT LAUNCHES, 2020–2024 190
・ TABLE 139 HENKEL AG & CO. KGAA: DEALS, 2020–2024 191
・ TABLE 140 HENKEL AG & CO. KGAA: OTHERS, 2020–2024 191
11.1.4 KYOCERA CORPORATION 193
・ TABLE 141 KYOCERA CORPORATION: COMPANY OVERVIEW 193
・ FIGURE 50 KYOCERA CORPORATION: COMPANY SNAPSHOT 194
・ TABLE 142 KYOCERA CORPORATION: PRODUCT OFFERINGS 194
・ TABLE 143 KYOCERA CORPORATION: PRODUCT LAUNCHES, 2020–2024 195
・ TABLE 144 KYOCERA CORPORATION: DEALS, 2020–2024 196
・ TABLE 145 KYOCERA CORPORATION: OTHER DEVELOPMENTS, 2020–2024 197
11.1.5 ASE 199
・ TABLE 146 ASE: COMPANY OVERVIEW 199
・ FIGURE 51 ASE: COMPANY SNAPSHOT 200
・ TABLE 147 ASE: PRODUCT OFFERINGS 201
・ TABLE 148 ASE: PRODUCT LAUNCHES, 2020–2024 202
・ TABLE 149 ASE: OTHER DEVELOPMENTS, 2020–2024 204
11.1.6 SILICONWARE PRECISION INDUSTRIES CO., LTD. 205
・ TABLE 150 SILICONWARE PRECISION INDUSTRIES CO., LTD.: COMPANY OVERVIEW 205
・ FIGURE 52 SILICONWARE PRECISION INDUSTRIES CO., LTD.: COMPANY SNAPSHOT 206
・ TABLE 151 SILICONWARE PRECISION INDUSTRIES CO., LTD.: PRODUCT OFFERINGS 206
・ TABLE 152 SILICONWARE PRECISION INDUSTRIES CO., LTD.: DEALS, 2020–2024 209
・ TABLE 153 SILICONWARE PRECISION INDUSTRIES CO., LTD.: OTHER DEVELOPMENTS, 2020–2024 209
11.1.7 AMKOR TECHNOLOGY 211
・ TABLE 154 AMKOR TECHNOLOGY: COMPANY OVERVIEW 211
・ FIGURE 53 AMKOR TECHNOLOGY: COMPANY SNAPSHOT 212
・ TABLE 155 AMKOR TECHNOLOGY: PRODUCT OFFERINGS 212
・ TABLE 156 AMKOR TECHNOLOGY: OTHERS, 2020–2024 215
11.1.8 TEXAS INSTRUMENTS 217
・ TABLE 157 TEXAS INSTRUMENTS: COMPANY OVERVIEW 217
・ FIGURE 54 TEXAS INSTRUMENTS: COMPANY SNAPSHOT 218
・ TABLE 158 TEXAS INSTRUMENTS: PRODUCT OFFERINGS 218
・ TABLE 159 TEXAS INSTRUMENTS: PRODUCT LAUNCHES, 2020–2024 221
・ TABLE 160 TEXAS INSTRUMENTS: OTHERS, 2020-2024 221
11.1.9 IBIDEN CO., LTD. 223
・ TABLE 161 IBIDEN CO., LTD.: COMPANY OVERVIEW 223
・ FIGURE 55 IBIDEN CO., LTD.: COMPANY SNAPSHOT 224
・ TABLE 162 IBIDEN CO., LTD.: PRODUCT OFFERINGS 225
11.1.10 POWERTECH TECHNOLOGY INC. 227
・ TABLE 163 POWERTECH TECHNOLOGY INC.: COMPANY OVERVIEW 227
・ FIGURE 56 POWERTECH TECHNOLOGY INC.: COMPANY SNAPSHOT 228
・ TABLE 164 POWERTECH TECHNOLOGY INC.: PRODUCT OFFERINGS 228
・ TABLE 165 POWERTECH TECHNOLOGY INC.: DEALS, 2020–2024 229
*DETAILS ON BUSINESS OVERVIEW, PRODUCTS OFFERED, RECENT DEVELOPMENTS & MNM VIEW MIGHT NOT BE CAPTURED IN CASE OF UNLISTED COMPANIES.
11.2 OTHER PLAYERS 230
11.2.1 CHIPMOS TECHNOLOGIES INC. 230
・ TABLE 166 CHIPMOS TECHNOLOGIES INC.: COMPANY OVERVIEW 230
11.2.2 TONG HSING ELECTRONIC INDUSTRIES LTD. 231
・ TABLE 167 TONG HSING ELECTRONIC INDUSTRIES LTD.: COMPANY OVERVIEW 231
11.2.3 NEPES CORPORATION LIMITED 232
・ TABLE 168 NEPES CORPORATION LIMITED: COMPANY OVERVIEW 232
11.2.4 SHINKO ELECTRIC INDUSTRIES CO., LTD. 233
・ TABLE 169 SHINKO ELECTRIC INDUSTRIES CO., LTD.: COMPANY OVERVIEW 233
11.2.5 DAEDUCK ELECTRONICS CO., LTD. 234
・ TABLE 170 DAEDUCK ELECTRONICS CO., LTD.: COMPANY OVERVIEW 234
11.2.6 MACDERMID PERFORMANCE SOLUTIONS 235
・ TABLE 171 MACDERMID PERFORMANCE SOLUTIONS: COMPANY OVERVIEW 235
11.2.7 RENESAS ELECTRONICS CORPORATION 236
・ TABLE 172 RENESAS ELECTRONICS CORPORATION: COMPANY OVERVIEW 236
11.2.8 SAMSUNG ELECTRO-MECHANICS 237
・ TABLE 173 SAMSUNG ELECTRO-MECHANICS: COMPANY OVERVIEW 237
11.2.9 UNIMICRON TECHNOLOGY CORPORATION 238
・ TABLE 174 UNIMICRON TECHNOLOGY CORPORATION: COMPANY OVERVIEW 238
11.2.10 CHIPBOND TECHNOLOGY CORPORATION 239
・ TABLE 175 CHIPBOND TECHNOLOGY CORPORATION: COMPANY OVERVIEW 239
11.2.11 TANAKA HOLDINGS CO., LTD. 240
・ TABLE 176 TANAKA HOLDINGS CO., LTD.: COMPANY OVERVIEW 240
11.2.12 NAN YA PLASTICS CORPORATION 241
・ TABLE 177 NAN YA PLASTICS CORPORATION: COMPANY OVERVIEW 241
11.2.13 HITACHI HIGH-TECH CORPORATION 242
・ TABLE 178 HITACHI HIGH-TECH CORPORATION: COMPANY OVERVIEW 242
11.2.14 SUMITOMO CHEMICAL COMPANY LIMITED 243
・ TABLE 179 SUMITOMO CHEMICAL COMPANY LIMITED: COMPANY OVERVIEW 243
11.2.15 VERISILICON 244
・ TABLE 180 VERISILICON: COMPANY OVERVIEW 244

12 APPENDIX 245

12.1 DISCUSSION GUIDE 245
12.2 KNOWLEDGESTORE: MARKETSANDMARKETS’ SUBSCRIPTION PORTAL 248
12.3 CUSTOMIZATION OPTIONS 250
12.4 RELATED REPORTS 250
12.5 AUTHOR DETAILS 251

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