次世代エネルギー産業・グリーン経済の国際リサーチ情報サイト

ダイボンダ(Die Bonder)の世界市場:デバイス別、用途別2024年予測

Die Bonder Equipment Market by Type (Semiautomatic Die Bonder, Fully Automatic Die Bonder), Bonding Technique, Supply Chain Participant (IDM Firms, OSAT Companies), Device, Application (Consumer Electronics), and Region - Global Forecast to 2024

出版元:MarketsandMarketsLinkIcon出版元について
発行年:2019年11月
定価 Single User License(1名様ライセンス)US$4,950(米国ドル)/Multi User License(5名様)$6,650 /Corporate User License $8,150
ご予算に応じた各種ご提案も承ります。詳細はお問い合わせください。
ご請求は円換算(お見積り日TTSレート)となります。
納品形態:PDF by Email
当調査レポートは英文168ページになります。
商品コード:MAM1758

お問い合わせ、お見積りのリクエストは下のボタンをクリックしてご入力ください。



【レポート紹介】
ダイボンダの世界市場規模は2019年の8億2000万ドルから、2024年には9億7200万ドルへと漸増が予測されます。当レポートでは、2024年に至るダイボンダの世界市場予測(市場規模US$)、タイプ別市場(手動、半自動、全自動)、ボンディング技術別市場(エポキシ、共晶、ソフトソルダー、その他)、事業者別市場(OSAT、IDM)、デバイス別市場(オプトエレクトロニクス、MEMS/MOEMS、パワーデバイス)、用途別市場(コンシューマーエレクトロニクス、自動車、インダストリアル、通信、ヘルスケア、航空宇宙、防衛)、主要国地域別市場など、詳細な市場予測データと分析を掲載しています。また市場分析、競合状況、主要メーカー企業11社プロフィール動向などの情報も交えて、ダイボンダ市場の現在と今後展開を予測分析していきます。

【レポート構成概要】
◆ダイボンダの世界市場予測2016-2024年
・市場規模(US$)

◆タイプ別、市場-2024年
・手動
・半自動
・全自動
※(市場規模US$) 
※タイプ別に全セグメントの細分化データ掲載

◆ボンディング技術別、市場-2024年
・エポキシ
・共晶
・ソフトソルダー
・その他
※(市場規模US$)
※ボンディング技術別にタイプ別の細分化データ掲載

◆事業者タイプ別、市場-2024年
・OSAT(後工程受託企業)
・IDM (垂直統合型デバイスメーカー)
※(市場規模US$) 

◆デバイス別、市場-2024年
・オプトエレクトロニクス
・MEMS・MOEMS
・パワーデバイス
※(市場規模US$) 

◆用途別、市場-2024年
・コンシューマーエレクトロニクス
・自動車
・インダストリアル
・通信
・ヘルスケア
・航空宇宙、防衛
※(市場規模US$) 
※用途別にタイプ別、デバイス別、事業者タイプ別の細分化データ掲載

◆主要国地域別市場-2024年
アジア太平洋
・日本、中国、台湾、韓国
・その他アジア太平洋
南北アメリカ
・米国、カナダ
・その他南北アメリカ
欧州/中東アフリカ
・ドイツ、英国、イスラエル、フランス
・その他欧州/中東アフリカ
※地域別に事業者タイプ別、デバイス別の細分化データ掲載、詳細は目次参照
※国別にデバイス別の細分化データ掲載、詳細は目次参照

◆市場分析
・市場ダイナミクス分析(ドライバー、障壁、機会、課題)
・バリューチェーン分析
・競合状況

◆ダイボンダの主要企業プロフィール動向
・BE SEMICONDUCTOR INDUSTRIES N.V.          
・ASM PACIFIC TECHNOLOGY LTD.     
・KULICKE & SOFFA      
・MYCRONIC AB            
・PALOMAR TECHNOLOGIES, INC.        
・WEST·BOND, INC.      
・MICROASSEMBLY TECHNOLOGIES, LTD.       
・FINETECH GMBH & CO. KG   
・DR. TRESKY AG          
・SMART EQUIPMENT TECHNOLOGY  
・RIGHT TO WIN           

(その他企業)
・HYBOND, INC.            
・澁谷工業株式会社
・ANZA TECHNOLOGY, INC.     
・PAROTEQ GMBH       
・TRESKY GMBH           
・DIAS AUTOMATION (HK) LTD            
・株式会社新川   
・FOUR TECHNOS CO., LTD.    
・FASFORD TECHNOLOGY CO., LTD.   
・UNITEMP GMBH        
・TPT WIRE BONDER GMBH & CO. KG

(全168頁)



【レポート詳細目次、データ項目一覧は当ページ下を参照ください】

英文詳細目次(table of contents)

【原文詳細目次】

Die Bonder Equipment Market by Type (Semiautomatic Die Bonder, Fully Automatic Die Bonder), Bonding Technique, Supply Chain Participant (IDM Firms, OSAT Companies), Device, Application (Consumer Electronics), and Region - Global Forecast to 2024

Table of Contents

1.... INTRODUCTION

1.1            STUDY OBJECTIVES
1.2            MARKET DEFINITION AND SCOPE
1.2.1               INCLUSIONS AND EXCLUSIONS
1.3            SCOPE
1.3.1               MARKETS COVERED.. 21
1.3.2               YEARS CONSIDERED.. 21
1.4            CURRENCY
1.5            LIMITATIONS
1.6            MARKET STAKEHOLDERS

2.... RESEARCH METHODOLOGY

2.1            RESEARCH DATA
2.1.1               SECONDARY DATA
2.1.1.1             SECONDARY SOURCES
2.1.2               PRIMARY DATA
2.1.2.1             BREAKDOWN OF PRIMARY INTERVIEWS
2.1.2.2             KEY DATA FROM PRIMARY SOURCES
2.2            MARKET SIZE ESTIMATION
2.2.1               BOTTOM-UP APPROACH
2.2.1.1             APPROACH FOR CAPTURING MARKET SIZE BY BOTTOM-UP
ANALYSIS (DEMAND SIDE)
2.2.2               TOP-DOWN APPROACH.. 30
2.2.2.1             APPROACH FOR CAPTURING MARKET SHARE BY TOP-DOWN
ANALYSIS (SUPPLY SIDE)
2.3            MARKET BREAKDOWN AND DATA TRIANGULATION
2.4            RESEARCH ASSUMPTIONS

3.... EXECUTIVE SUMMARY

4.... PREMIUM INSIGHTS

4.1            ATTRACTIVE GROWTH OPPORTUNITIES IN DIE BONDER EQUIPMENT MARKET
4.2            DIE BONDER EQUIPMENT MARKET, BY COUNTRY
4.3            DIE BONDER EQUIPMENT MARKET, BY BONDING TECHNIQUE
4.4            DIE BONDER EQUIPMENT MARKET, BY APPLICATION AND REGION


5.... MARKET OVERVIEW

5.1            INTRODUCTION
5.2            MARKET DYNAMICS
5.2.1               DRIVERS
5.2.1.1             GROWING DEMAND FOR MINIATURE ELECTRONIC COMPONENTS
5.2.1.2             INCREASING ADOPTION OF STACKED DIE TECHNOLOGY IN IOT DEVICES
5.2.2               RESTRAINTS
5.2.2.1             HIGH COST OF OWNERSHIP
5.2.3               OPPORTUNITIES
5.2.3.1             INCREASING DEMAND FOR 3D SEMICONDUCTOR ASSEMBLY AND PACKAGING
5.2.4               CHALLENGES
5.2.4.1             MECHANICAL UNBALANCE OF MOVING PARTS
5.3            VALUE CHAIN ANALYSIS
5.3.1               DIE BONDER EQUIPMENT VALUE CHAIN

6.... DIE BONDER EQUIPMENT MARKET, BY TYPE. 48

6.1            INTRODUCTION
6.2            MANUAL DIE BONDERS
6.2.1               MANUAL DIE BONDERS PLAY SIGNIFICANT ROLE IN R&D, TESTING, AND PROTOTYPING APPLICATIONS
6.3            SEMIAUTOMATIC DIE BONDERS
6.3.1               SEMIAUTOMATIC DIE BONDERS ARE EASY TO USE AND FLEXIBLE
6.4            FULLY AUTOMATIC DIE BONDERS
6.4.1               FULLY AUTOMATIC DIE BONDERS TO CONTINUE TO REGISTER HIGHEST CAGR AND LARGEST MARKET SIZE DURING 2019–2024

7.... DIE BONDER EQUIPMENT MARKET, BY BONDING TECHNIQUE

7.1            INTRODUCTION
7.2            EPOXY
7.2.1               EPOXY BONDING TO ACCOUNT FOR LARGEST SHARE OF DIE BONDER EQUIPMENT MARKET DUE TO LOW COST AND LOW CURING TEMPERATURE
7.3            EUTECTIC
7.3.1               DIE BONDER EQUIPMENT MARKET FOR EUTECTIC BONDING TECHNIQUE TO GROW AT HIGHEST CAGR DURING FORECAST PERIOD
7.4            SOFT SOLDER
7.4.1               SOFT SOLDER BOIDNG PLAYS SIGNIFICANT ROLE IN FABRICATION OF POWER DEVICES
7.5            OTHERS
7.5.1               ASSEMBLY OF TEMPERATURE-RESTRICTED PRODUCTS FUEL GROWTH OF MARKET FOR OTHER BONDING TECHNIQUES


8.... DIE BONDER EQUIPMENT MARKET, BY SUPPLY CHAIN PARTICIPANT

8.1            INTRODUCTION
8.2            OSAT COMPANIES
8.2.1               OSAT COMPANIES TO PLAY SIGNIFICANT ROLE OWING TO CHALLENGES FACED BY FOUNDRIES RELATED TO ASSEMBLY AND PACKAGING
8.3            IDM FIRMS
8.3.1               IDM FIRMS TO CONTINUE TO LEAD DIE BONDER EQUIPMENT MARKET OWING TO THEIR ABILITY TO PROGRESS RAPIDLY WITH INNOVATIVE TECHNOLOGIES DURING FORECAST PERIOD

9.... DIE BONDER EQUIPMENT MARKET, BY DEVICE. 77

9.1            INTRODUCTION
9.2            OPTOELECTRONICS
9.2.1               OPTOELECTRONICS TO CONTINUE TO ACCOUNT FOR LARGEST SHARE OF DIE BONDER EQUIPMENT MARKET DURING FORECAST PERIOD
9.3            MEMS AND MOEMS
9.3.1               AUTOMOTIVE, CONSUMER ELECTRONICS, HEALTHCARE, AND TELECOMMUNICATIONS SECTORS CONTRIBUTE MOST TO HIGHEST CAGR OF MEMS AND MOEMS DEVICES IN COMING YEARS
9.4            POWER DEVICES
9.4.1               DIE ATTACH PACKAGING METHODOLOGY ENABLES POWER DEVICES TO WITHSTAND EXTREME OPERATING CONDITIONS. 87

10.. DIE BONDER EQUIPMENT MARKET, BY APPLICATION

10.1          INTRODUCTION
10.2          CONSUMER ELECTRONICS
10.2.1             INCREASING ADOPTION OF MINIATURIZED AND LIGHTWEIGHT ELECTRONIC PRODUCTS ACCELERATES DEMAND FOR DIE BONDERS
10.3          AUTOMOTIVE
10.3.1             RISING USE OF MEMS TO ENSURE IMPROVED PASSENGER SAFETY WOULD SPUR DEMAND FOR DIE BONDERS IN AUTOMOTIVE APPLICATIONS
10.4          INDUSTRIAL
10.4.1             GROWING IMPLEMENTATION OF INDUSTRIAL IOT TO DRIVE GROWTH OF DIE BONDER EQUIPMENT MARKET FOR INDUSTRIAL APPLICATIONS
10.5          TELECOMMUNICATIONS
10.5.1             RISING DEPLOYMENT OF 5G NETWORK INFRASTRUCTURE CONTRIBUTING TO GROWTH OF DIE BONDER EQUIPMENT MARKET FOR TELECOMMUNICATIONS APPLICATIONS
10.6          HEALTHCARE
10.6.1             SURGING DEMAND FOR NANO-SIZED AND LIGHTWEIGHT HEALTHCARE GADGETS AUGMENTS ADOPTION OF DIE BONDERS IN HEALTHCARE APPLICATIONS
10.7          AEROSPACE & DEFENSE
10.7.1             INCREASING DEMAND FOR ROBUST COMPONENTS BOOSTING DIE BONDER MARKET GROWTH FOR AEROSPACE & DEFENSE APPLICATIONS

11.. GEOGRAPHIC ANALYSIS

11.1          INTRODUCTION
11.2          APAC
11.2.1             TAIWAN
11.2.1.1           PRESENCE OF MANY KEY OSAT COMPANIES DRIVES MARKET GROWTH IN TAIWAN.. 107
11.2.2             CHINA
11.2.2.1           GROWING TREND OF MINIATURIZATION IN CONSUMER ELECTRONIC PRODUCTS SPURS GROWTH OF MARKET IN CHINA
11.2.3             JAPAN
11.2.3.1           INCREASING DEMAND FOR PASSENGER CARS AND COMMERCIAL VEHICLES AND EXPANDING PRESENCE OF MARKET PLAYERS IN COUNTRY FUELS GROWTH OF DIE BONDER EQUIPMENT MARKET IN JAPAN
11.2.4             SOUTH KOREA
11.2.4.1           SOUTH KOREA TO CONTINUE TO ACCOUNT FOR LARGEST SIZE OF MARKET IN APAC DURING 2019–2024
11.2.5             REST OF APAC
11.2.5.1           STRONG PRESENCE OF DIE BONDER EQUIPMENT MANUFACTURES ACCELERATES MARKET GROWTH IN REST OF APAC
11.3          AMERICAS
11.3.1             US
11.3.1.1           US TO CONTINUE TO LEAD DIE BONDER EQUIPMENT MARKET IN AMERICAS DURING 2019–2024
11.3.2             CANADA
11.3.2.1           GOVERNMENT INITIATIVES TOWARD DEVELOPING ELECTRIC VEHICLE INFRASTRUCTURE TO CREATE GROWTH OPPORTUNITIES FOR DIE BONDER EQUIPMENT MARKET IN NEAR FUTURE
11.3.3             REST OF AMERICAS. 115
11.3.3.1           INCREASING DEMAND FOR IOT AND 5G SURGING DEMAND FOR DIE BONDING EQUIPMENT IN REST OF AMERICAS
11.4          EMEA
11.4.1             GERMANY
11.4.1.1           ADOPTION OF SMART HOMES AND CONNECTED CARS TO SPUR DEMAND IN GERMANY  119
11.4.2             UK
11.4.2.1           DEPLOYMENT OF 5G INFRASTRUCTURE FUELING MARKET GROWTH IN UK
11.4.3             ISRAEL
11.4.3.1           PRESENCE OF FABRICATION PLANTS OF IDM COMPANIES INCLUDING INTEL AND TOWER JAZZ TO BOOST MARKET GROWTH IN ISRAEL
11.4.4             FRANCE
11.4.4.1           DEVELOPED COMMUNICATION NETWORK HAS PROMPTED MARKET GROWTH IN FRANCE
11.4.5             REST OF EMEA
11.4.5.1           INITIATIVES OF DIE BONDER EQUIPMENT MANUFACTURERS TO PROPEL MARKET GROWTH IN REST OF EMEA

12.. COMPETITIVE LANDSCAPE

12.1          INTRODUCTION
12.2          MARKET RANKING ANALYSIS, 2018
12.3          COMPETITIVE SCENARIO
12.3.1             PRODUCT LAUNCHES. 125
12.3.2             PARTNERSHIPS, COLLABORATIONS, CONTRACTS AND AGREEMENTS
12.3.3             ACQUISITIONS
12.3.4             EXPANSIONS
12.4          COMPETITIVE LEADERSHIP MAPPING
12.4.1             VISIONARY LEADERS
12.4.2             DYNAMIC DIFFERENTIATORS
12.4.3             INNOVATORS
12.4.4             EMERGING COMPANIES
12.5          STRENGTH OF PRODUCT PORTFOLIO
12.6          BUSINESS STRATEGY EXCELLENCE

13.. COMPANY PROFILES

13.1          KEY PLAYERS
(BUSINESS OVERVIEW, PRODUCTS OFFERED, RECENT DEVELOPMENTS, SWOT ANALYSIS, MNM VIEW)*
13.1.1             BE SEMICONDUCTOR INDUSTRIES N.V.
13.1.2             ASM PACIFIC TECHNOLOGY LTD.
13.1.3             KULICKE & SOFFA
13.1.4             MYCRONIC AB
13.1.5             PALOMAR TECHNOLOGIES, INC.
13.1.6             WEST·BOND, INC. 148
13.1.7             MICROASSEMBLY TECHNOLOGIES, LTD.
13.1.8             FINETECH GMBH & CO. KG
13.1.9             DR. TRESKY AG
13.1.10          SMART EQUIPMENT TECHNOLOGY. 153
13.2          RIGHT TO WIN
13.3          OTHER KEY PLAYERS
13.3.1             HYBOND, INC.
13.3.2             SHIBUYA CORPORATION
13.3.3             ANZA TECHNOLOGY, INC.
13.3.4             PAROTEQ GMBH
13.3.5             TRESKY GMBH
13.3.6             DIAS AUTOMATION (HK) LTD
13.3.7             SHINKAWA LTD.
13.3.8             FOUR TECHNOS CO., LTD.

13.3.9             FASFORD TECHNOLOGY CO., LTD.
13.3.10          UNITEMP GMBH
13.3.11          TPT WIRE BONDER GMBH & CO. KG
*DETAILS ON BUSINESS OVERVIEW, PRODUCTS OFFERED, RECENT DEVELOPMENTS, SWOT ANALYSIS, MNM VIEW MIGHT NOT BE CAPTURED IN CASE OF UNLISTED COMPANIES.
14.. APPENDIX

LIST OF TABLES

TABLE 1               DIE BONDER EQUIPMENT MARKET, BY TYPE, 2016–2024 (USD MILLION)
TABLE 2               MANUAL DIE BONDER EQUIPMENT MARKET, BY BONDING TECHNIQUE,
2016–2024 (USD MILLION)
TABLE 3               MANUAL DIE BONDER EQUIPMENT MARKET, BY DEVICE,
2016–2024 (USD MILLION)
TABLE 4               MANUAL DIE BONDER EQUIPMENT MARKET FOR OPTOELECTRONICS,
BY APPLICATION, 2016–2024 (USD MILLION)
TABLE 5               MANUAL DIE BONDER EQUIPMENT MARKET FOR MEMS AND MOEMS,
BY APPLICATION, 2016–2024 (USD MILLION)
TABLE 6               MANUAL DIE BONDER EQUIPMENT MARKET FOR POWER DEVICES,
BY APPLICATION, 2016–2024 (USD MILLION)
TABLE 7               MANUAL DIE BONDER EQUIPMENT MARKET, BY APPLICATION,
2016–2024 (USD MILLION)
TABLE 8               MANUAL DIE BONDER EQUIPMENT MARKET, BY SUPPLY CHAIN PARTICIPANT, 2016–2024 (USD MILLION)
TABLE 9               SEMIAUTOMATIC DIE BONDER EQUIPMENT MARKET, BY BONDING TECHNIQUE, 2016–2024 (USD MILLION)
TABLE 10             SEMIAUTOMATIC DIE BONDER EQUIPMENT MARKET, BY DEVICE,
2016–2024 (USD MILLION)
TABLE 11             SEMIAUTOMATIC DIE BONDER EQUIPMENT MARKET FOR OPTOELECTRONICS,
BY APPLICATION, 2016–2024 (USD MILLION)
TABLE 12             SEMIAUTOMATIC DIE BONDER EQUIPMENT MARKET FOR MEMS AND MOEMS,
BY APPLICATION, 2016–2024 (USD MILLION)
TABLE 13             SEMIAUTOMATIC DIE BONDER EQUIPMENT MARKET FOR POWER DEVICES,
BY APPLICATION, 2016–2024 (USD MILLION)
TABLE 14             SEMIAUTOMATIC DIE BONDER EQUIPMENT MARKET, BY APPLICATION,
2016–2024 (USD MILLION)
TABLE 15             SEMIAUTOMATIC DIE BONDER EQUIPMENT MARKET, BY SUPPLY CHAIN PARTICIPANT, 2016–2024 (USD MILLION)
TABLE 16             FULLY AUTOMATIC DIE BONDER EQUIPMENT MARKET, BY BONDING TECHNIQUE, 2016–2024 (USD MILLION)
TABLE 17             FULLY AUTOMATIC DIE BONDER EQUIPMENT MARKET, BY DEVICE,
2016–2024 (USD MILLION)
TABLE 18             FULLY AUTOMATIC DIE BONDER EQUIPMENT MARKET FOR OPTOELECTRONICS,
BY APPLICATION, 2016–2024 (USD MILLION)
TABLE 19             FULLY AUTOMATIC DIE BONDER EQUIPMENT MARKET FOR MEMS AND MOEMS,
BY APPLICATION, 2016–2024 (USD MILLION)
TABLE 20             FULLY AUTOMATIC DIE BONDER EQUIPMENT MARKET FOR POWER DEVICES,
BY APPLICATION, 2016–2024 (USD MILLION)
TABLE 21             FULLY AUTOMATIC DIE BONDER EQUIPMENT MARKET, BY APPLICATION,
2016–2024 (USD MILLION)
TABLE 22             FULLY AUTOMATIC DIE BONDER EQUIPMENT MARKET, BY SUPPLY CHAIN PARTICIPANT, 2016–2024 (USD MILLION)
TABLE 23             DIE BONDER EQUIPMENT MARKET, BY BONDING TECHNIQUE,
2016–2024 (USD MILLION)
TABLE 24             DIE BONDER EQUIPMENT MARKET FOR EPOXY BONDING TECHNIQUE,
BY TYPE, 2016–2024 (USD MILLION)
TABLE 25             DIE BONDER EQUIPMENT MARKET FOR EUTECTIC BONDING TECHNIQUE,
BY TYPE, 2016–2024 (USD MILLION)
TABLE 26             DIE BONDER EQUIPMENT MARKET FOR SOFT SOLDER BONDING TECHNIQUE,
BY TYPE, 2016–2024 (USD MILLION)
TABLE 27             DIE BONDER EQUIPMENT MARKET FOR OTHER BONDING TECHNIQUES,
BY TYPE, 2016–2024 (USD MILLION)
TABLE 28             DIE BONDER EQUIPMENT MARKET, BY SUPPLY CHAIN PARTICIPANT,
2016–2024 (USD MILLION)
TABLE 29             DIE BONDER EQUIPMENT MARKET FOR OSAT COMPANIES, BY TYPE,
2016–2024 (USD MILLION)
TABLE 30             DIE BONDER EQUIPMENT MARKET FOR OSAT COMPANIES, BY DEVICE,
2016–2024 (USD MILLION)
TABLE 31             DIE BONDER EQUIPMENT MARKET FOR OPTOELECTRONICS IN OSAT COMPANIES, BY REGION, 2016–2024 (USD MILLION)
TABLE 32             DIE BONDER EQUIPMENT MARKET FOR MEMS AND MOEMS IN OSAT COMPANIES, BY REGION, 2016–2024 (USD MILLION)
TABLE 33             DIE BONDER EQUIPMENT MARKET FOR POWER DEVICES IN OSAT COMPANIES,
BY REGION, 2016–2024 (USD THOUSAND)
TABLE 34             DIE BONDER EQUIPMENT MARKET FOR OSAT COMPANIES, BY REGION,
2016–2024 (USD MILLION)
TABLE 35             DIE BONDER EQUIPMENT MARKET FOR OSAT COMPANIES, BY APPLICATION, 2016–2024 (USD MILLION)
TABLE 36             DIE BONDER EQUIPMENT MARKET FOR IDM FIRMS, BY TYPE,
2016–2024 (USD MILLION)
TABLE 37             DIE BONDER EQUIPMENT MARKET FOR IDM FIRMS, BY DEVICE,
2016–2024 (USD MILLION)
TABLE 38             DIE BONDER EQUIPMENT MARKET FOR OPTOELECTRONICS IN IDM FIRMS,
BY REGION, 2016–2024 (USD THOUSAND)
TABLE 39             DIE BONDER EQUIPMENT MARKET FOR MEMS AND MOEMS IN IDM FIRMS,
BY REGION, 2016–2024 (USD MILLION)
TABLE 40             DIE BONDER EQUIPMENT MARKET FOR POWER DEVICES IN IDM FIRMS,
BY REGION, 2016–2024 (USD MILLION)
TABLE 41             DIE BONDER EQUIPMENT MARKET FOR IDM FIRMS, BY REGION,
2016–2024 (USD MILLION)
TABLE 42             DIE BONDER EQUIPMENT MARKET FOR IDM FIRMS, BY APPLICATION,
2016–2024 (USD THOUSAND)
TABLE 43             DIE BONDER EQUIPMENT MARKET, BY DEVICE, 2016–2024 (USD MILLION)
TABLE 44             DIE BONDER EQUIPMENT MARKET FOR OPTOELECTRONICS, BY TYPE,
2016–2024 (USD MILLION)
TABLE 45             DIE BONDER EQUIPMENT MARKET FOR OPTOELECTRONICS, BY SUPPLY CHAIN PARTICIPANT, 2016–2024 (USD MILLION)
TABLE 46             DIE BONDER EQUIPMENT MARKET FOR OPTOELECTRONICS, BY APPLICATION, 2016–2024 (USD MILLION)
TABLE 47             DIE BONDER EQUIPMENT MARKET FOR OPTOELECTRONICS, BY REGION,
2016–2024 (USD MILLION)
TABLE 48             DIE BONDER EQUIPMENT MARKET IN APAC FOR OPTOELECTRONICS, BY COUNTRY, 2016–2024 (USD MILLION)
TABLE 49             DIE BONDER EQUIPMENT MARKET IN AMERICAS FOR OPTOELECTRONICS,
BY COUNTRY, 2016–2024 (USD MILLION)
TABLE 50             DIE BONDER EQUIPMENT MARKET IN EMEA FOR OPTOELECTRONICS,
BY COUNTRY, 2016–2024 (USD THOUSAND)
TABLE 51             DIE BONDER EQUIPMENT MARKET FOR MEMS AND MOEMS, BY TYPE,
2016–2024 (USD MILLION)
TABLE 52             DIE BONDER EQUIPMENT MARKET FOR MEMS AND MOEMS, BY SUPPLY CHAIN PARTICIPANT, 2016–2024 (USD MILLION)
TABLE 53             DIE BONDER EQUIPMENT MARKET FOR MEMS AND MOEMS, BY APPLICATION, 2016–2024 (USD MILLION)
TABLE 54             DIE BONDER EQUIPMENT MARKET FOR MEMS AND MOEMS, BY REGION,
2016–2024 (USD MILLION)
TABLE 55             DIE BONDER EQUIPMENT MARKET IN APAC FOR MEMS AND MOEMS,
BY COUNTRY, 2016–2024 (USD MILLION)
TABLE 56             DIE BONDER EQUIPMENT MARKET IN AMERICAS FOR MEMS AND MOEMS,
BY COUNTRY, 2016–2024 (USD MILLION)
TABLE 57             DIE BONDER EQUIPMENT MARKET FOR MEMS AND MOEMS IN EMEA,
BY COUNTRY, 2016–2024 (USD THOUSAND)
TABLE 58             DIE BONDER EQUIPMENT MARKET FOR POWER DEVICES, BY TYPE,
2016–2024 (USD MILLION)
TABLE 59             DIE BONDER EQUIPMENT MARKET FOR POWER DEVICES, BY SUPPLY CHAIN PARTICIPANT, 2016–2024 (USD MILLION)
TABLE 60             DIE BONDER EQUIPMENT MARKET FOR POWER DEVICES, BY APPLICATION,
2016–2024 (USD MILLION)
TABLE 61             DIE BONDER EQUIPMENT MARKET FOR POWER DEVICES, BY REGION,
2016–2024 (USD MILLION)
TABLE 62             DIE BONDER EQUIPMENT MARKET IN APAC FOR POWER DEVICES,
BY COUNTRY, 2016–2024 (USD MILLION)
TABLE 63             DIE BONDER EQUIPMENT MARKET IN AMERICAS FOR POWER DEVICES,
BY COUNTRY, 2016–2024 (USD MILLION)
TABLE 64             DIE BONDER EQUIPMENT MARKET IN EMEA FOR POWER DEVICES,
BY COUNTRY, 2016–2024 (USD THOUSAND)
TABLE 65             DIE BONDER EQUIPMENT MARKET, BY APPLICATION, 2016–2024 (USD MILLION)
TABLE 66             DIE BONDER EQUIPMENT MARKET FOR CONSUMER ELECTRONICS APPLICATIONS, BY TYPE, 2016–2024 (USD MILLION)
TABLE 67             DIE BONDER EQUIPMENT MARKET FOR CONSUMER ELECTRONICS APPLICATIONS, BY SUPPLY CHAIN PARTICIPANT, 2016–2024 (USD MILLION)
TABLE 68             DIE BONDER EQUIPMENT MARKET FOR CONSUMER ELECTRONICS APPLICATIONS, BY DEVICE, 2016–2024 (USD MILLION)
TABLE 69             DIE BONDER EQUIPMENT MARKET FOR AUTOMOTIVE APPLICATIONS,
BY TYPE, 2016–2024 (USD MILLION)
TABLE 70             DIE BONDER EQUIPMENT MARKET FOR AUTOMOTIVE APPLICATIONS, BY SUPPLY CHAIN PARTICIPANT, 2016–2024 (USD MILLION)
TABLE 71             DIE BONDER EQUIPMENT MARKET FOR AUTOMOTIVE APPLICATIONS, BY DEVICE, 2016–2024 (USD MILLION)
TABLE 72             DIE BONDER EQUIPMENT MARKET FOR INDUSTRIAL APPLICATIONS,
BY TYPE, 2016–2024 (USD MILLION)
TABLE 73             DIE BONDER EQUIPMENT MARKET FOR INDUSTRIAL APPLICATIONS, BY SUPPLY CHAIN PARTICIPANT, 2016–2024 (USD MILLION)
TABLE 74             DIE BONDER EQUIPMENT MARKET FOR INDUSTRIAL APPLICATIONS, BY DEVICE, 2016–2024 (USD MILLION)
TABLE 75             DIE BONDER EQUIPMENT MARKET FOR TELECOMMUNICATIONS APPLICATIONS,
BY TYPE, 2016–2024 (USD MILLION)
TABLE 76             DIE BONDER EQUIPMENT MARKET FOR TELECOMMUNICATIONS APPLICATIONS,
BY SUPPLY CHAIN PARTICIPANT, 2016–2024 (USD MILLION)
TABLE 77             DIE BONDER EQUIPMENT MARKET FOR TELECOMMUNICATIONS APPLICATIONS,
BY DEVICE, 2016–2024 (USD MILLION)
TABLE 78             DIE BONDER EQUIPMENT MARKET FOR HEALTHCARE APPLICATIONS,
BY TYPE, 2016–2024 (USD MILLION)
TABLE 79             DIE BONDER EQUIPMENT MARKET FOR HEALTHCARE APPLICATIONS, BY SUPPLY CHAIN PARTICIPANT, 2016–2024 (USD MILLION)
TABLE 80             DIE BONDER EQUIPMENT MARKET FOR HEALTHCARE APPLICATIONS, BY DEVICE, 2016–2024 (USD MILLION)
TABLE 81             DIE BONDER EQUIPMENT MARKET FOR AEROSPACE & DEFENSE APPLICATIONS, BY TYPE, 2016–2024 (USD MILLION)
TABLE 82             DIE BONDER EQUIPMENT MARKET FOR AEROSPACE & DEFENSE APPLICATIONS, BY SUPPLY CHAIN PARTICIPANT, 2016–2024 (USD THOUSAND)
TABLE 83             DIE BONDER EQUIPMENT MARKET FOR AEROSPACE & DEFENSE APPLICATIONS, BY DEVICE, 2016–2024 (USD MILLION)
TABLE 84             DIE BONDER EQUIPMENT MARKET, BY REGION, 2016–2024 (USD MILLION)
TABLE 85             DIE BONDER EQUIPMENT MARKET IN APAC, BY SUPPLY CHAIN PARTICIPANT, 2016–2024 (USD MILLION)
TABLE 86             DIE BONDER EQUIPMENT MARKET IN APAC, BY DEVICE,
2016–2024 (USD MILLION)
TABLE 87             DIE BONDER EQUIPMENT MARKET IN APAC, BY COUNTRY,
2016–2024 (USD MILLION)
TABLE 88             DIE BONDER EQUIPMENT MARKET IN TAIWAN, BY DEVICE,
2016–2024 (USD MILLION)
TABLE 89             DIE BONDER EQUIPMENT MARKET IN CHINA, BY DEVICE,
2016–2024 (USD MILLION)
TABLE 90             DIE BONDER EQUIPMENT MARKET IN JAPAN, BY DEVICE,
2016–2024 (USD MILLION)
TABLE 91             DIE BONDER EQUIPMENT MARKET IN SOUTH KOREA, BY DEVICE,
2016–2024 (USD MILLION)
TABLE 92             DIE BONDER EQUIPMENT MARKET IN REST OF APAC, BY DEVICE,
2016–2024 (USD MILLION)
TABLE 93             DIE BONDER EQUIPMENT MARKET IN AMERICAS, BY SUPPLY CHAIN PARTICIPANT, 2016–2024 (USD MILLION)
TABLE 94             DIE BONDER EQUIPMENT MARKET IN AMERICAS, BY DEVICE,
2016–2024 (USD MILLION)
TABLE 95             DIE BONDER EQUIPMENT MARKET IN AMERICAS, BY COUNTRY,
2016–2024 (USD MILLION)
TABLE 96             DIE BONDER EQUIPMENT MARKET IN US, BY DEVICE, 2016–2024 (USD MILLION)
TABLE 97             DIE BONDER EQUIPMENT MARKET IN CANADA, BY DEVICE,
2016–2024 (USD THOUSAND)
TABLE 98             DIE BONDER EQUIPMENT MARKET IN REST OF AMERICAS, BY DEVICE,
2016–2024 (USD MILLION)
TABLE 99             DIE BONDER EQUIPMENT MARKET IN EMEA, BY SUPPLY CHAIN PARTICIPANT, 2016–2024 (USD MILLION)
TABLE 100          DIE BONDER EQUIPMENT MARKET IN EMEA, BY DEVICE,
2016–2024 (USD MILLION)
TABLE 101          DIE BONDER EQUIPMENT MARKET IN EMEA, BY COUNTRY,
2016–2024 (USD MILLION)
TABLE 102          DIE BONDER EQUIPMENT MARKET IN GERMANY, BY DEVICE,
2016–2024 (USD MILLION)
TABLE 103          DIE BONDER EQUIPMENT MARKET IN UK, BY DEVICE,
2016–2024 (USD THOUSAND)
TABLE 104          DIE BONDER EQUIPMENT MARKET IN ISRAEL, BY DEVICE,
2016–2024 (USD THOUSAND)
TABLE 105          DIE BONDER EQUIPMENT MARKET IN FRANCE, BY DEVICE,
2016–2024 (USD THOUSAND)
TABLE 106          DIE BONDER EQUIPMENT MARKET IN REST OF EMEA, BY DEVICE,
2016–2024 (USD THOUSAND)
TABLE 107          PRODUCT LAUNCHES, 2017–2019
TABLE 108          PARTNERSHIPS, COLLABORATIONS, CONTRACTS AND AGREEMENTS,
2017–2019
TABLE 109          ACQUISITIONS, 2018
TABLE 110          EXPANSIONS, 2017–2019

LIST OF FIGURES

FIGURE 1             DIE BONDER EQUIPMENT MARKET: RESEARCH DESIGN
FIGURE 2             MARKET SIZE ESTIMATION METHODOLOGY: APPROACH 1 (SUPPLY SIDE): REVENUE GENERATED FROM PRODUCTS IN DIE BONDER EQUIPMENT MARKET
FIGURE 3             MARKET SIZE ESTIMATION METHODOLOGY: APPROACH 2 BOTTOM-UP
(SUPPLY SIDE): ILLUSTRATIVE EXAMPLE OF COMPANY IN DIE BONDER EQUIPMENT MARKET
FIGURE 4             MARKET SIZE ESTIMATION METHODOLOGY: APPROACH 2 – BOTTOM-UP (DEMAND SIDE): SUPPLY CHAIN PARTICIPANTS COVERED UNDER DIE BONDER EQUIPMENT MARKET
FIGURE 5             MARKET SIZE ESTIMATION METHODOLOGY: APPROACH 3 – BOTTOM-UP MARKET ESTIMATION FOR DIE BONDER EQUIPMENT, BY TYPE
FIGURE 6             MARKET SIZE ESTIMATION METHODOLOGY: BOTTOM-UP APPROACH
FIGURE 7             MARKET SIZE ESTIMATION METHODOLOGY: TOP-DOWN APPROACH
FIGURE 8             DATA TRIANGULATION
FIGURE 9             RESEARCH STUDY ASSUMPTIONS
FIGURE 10          MARKET FOR FULLY AUTOMATIC DIE BONDER EQUIPMENT TO GROW AT HIGHEST CAGR DURING 2019–2024
FIGURE 11          DIE BONDER EQUIPMENT MARKET FOR IDM FIRMS TO GROW AT HIGHER CAGR DURING 2019–2024
FIGURE 12          AUTOMOTIVE APPLICATION TO WITNESS HIGHEST CAGR IN DIE BONDER EQUIPMENT MARKET DURING 2019–2024
FIGURE 13          APAC TO BE FASTEST-GROWING REGION IN DIE BONDER EQUIPMENT MARKET DURING FORECAST PERIOD
FIGURE 14          INCREASING DEMAND FOR MINIATURIZED ELECTRONIC DEVICES TO SPUR DIE BONDER EQUIPMENT MARKET GROWTH DURING FORECAST PERIOD
FIGURE 15          CHINA TO RECORD HIGHEST CAGR IN OVERALL DIE BONDER EQUIPMENT MARKET DURING FORECAST PERIOD
FIGURE 16          EPOXY BONDING TECHNIQUE TO CONTINUE TO ACCOUNT FOR LARGEST SHARE OF DIE BONDER EQUIPMENT MARKET TILL 2024
FIGURE 17          CONSUMER ELECTRONICS AND APAC LIKELY TO BE LARGEST SHAREHOLDERS IN OVERALL DIE BONDER EQUIPMENT MARKET, BY APPLICATION AND REGION, RESPECTIVELY, IN 2024   40
FIGURE 18          GROWING DEMAND OF MINIATURIZATION OF ELECTRONIC DEVICES TO DRIVE DIE BONDER EQUIPMENT MARKET
FIGURE 19          DIE BONDER EQUIPMENT MARKET DRIVERS AND THEIR IMPACT
FIGURE 20          DIE BONDER EQUIPMENT MARKET RESTRAINTS AND THEIR IMPACT
FIGURE 21          DIE BONDER EQUIPMENT MARKET OPPORTUNITIES AND THEIR IMPACT
FIGURE 22          DIE BONDER EQUIPMENT MARKET CHALLENGES AND THEIR IMPACT
FIGURE 23          DIE BONDER EQUIPMENT ECOSYSTEM: MAJOR VALUE IS ADDED BY PRODUCT MANUFACTURERS  47
FIGURE 24          DIE BONDER EQUIPMENT MARKET, BY TYPE
FIGURE 25          MARKET FOR FULLY AUTOMATIC DIE BONDERS TO GROW AT HIGHEST CAGR DURING FORECAST PERIOD
FIGURE 26          MANUAL DIE BONDER EQUIPMENT MARKET FOR AUTOMOTIVE APPLICATION TO GROW AT HIGHEST CAGR DURING FORECAST PERIOD
FIGURE 27          IDM FIRMS TO EXHIBIT HIGHER CAGR IN SEMIAUTOMATIC DIE BONDING EQUIPMENT MARKET DURING FORECAST PERIOD
FIGURE 28          FULLY DIE BONDER EQUIPMENT MARKET FOR AUTOMOTIVE APPLICATION TO GROW AT HIGHEST CAGR DURING FORECAST PERIOD
FIGURE 29          DIE BONDER EQUIPMENT MARKET, BY BONDING TECHNIQUE
FIGURE 30          MARKET FOR EUTECTIC BONDING TECHNIQUE TO GROW AT HIGHEST CAGR DURING FORECAST PERIOD
FIGURE 31          FULLY AUTOMATIC SOFT SOLDER DIE BONDERS TO DOMINATE MARKET DURING FORECAST PERIOD
FIGURE 32          DIE BONDER EQUIPMENT MARKET, BY SUPPLY CHAIN PARTICIPANT
FIGURE 33          IDM FIRMS TO COMMAND DIE BONDER EQUIPMENT MARKET
DURING 2019–2024
FIGURE 34          APAC TO REGISTER HIGHEST CAGR IN DIE BONDER EQUIPMENT MARKET FOR OSAT COMPANIES DURING FORECAST PERIOD
FIGURE 35          AUTOMOTIVE APPLICATION TO RECORD HIGHEST CAGR IN DIE BONDER MARKET FOR IDM FIRMS DURING FORECAST PERIOD
FIGURE 36          DIE BONDER EQUIPMENT MAREKT, BY DEVICE
FIGURE 37          DIE BONDER EQUIPMENT MARKET FOR MEMS AND MOEMS DEVICES TO GROW AT HIGHEST CAGR DURING FORECAST PERIOD
FIGURE 38          APAC TO REGISTER HIGHEST CAGR IN DIE BONDER EQUIPMENT MARKET FOR OPTOELECTRONICS DURING FORECAST PERIOD
FIGURE 39          FULLY AUTOMATIC DIE BONDER EQUIPMENT MARKET FOR MEMS AND MOEMS DEVICES TO GROW AT HIGHEST CAGR DURING FORECAST PERIOD
FIGURE 40          GERMANY TO DOMINATE DIE BONDER EQUIPMENT MARKET FOR MEMS AND MOEMS DURING FORECAST PERIOD
FIGURE 41          AUTOMOTIVE APPLICATION TO WITNESS HIGHEST CAGR IN DIE BONDER EQUIPMENT MARKET FOR POWER DEVICES DURING FORECAST PERIOD
FIGURE 42          DIE BONDER EQUIPMENT MAREKT, BY APPLICATION
FIGURE 43          DIE BONDER EQUIPMENT MARKET FOR AUTOMOTIVE APPLICATION TO GROW AT HIGHEST CAGR DURING FORECAST PERIOD
FIGURE 44          FULLY AUTOMATIC DIE BONDERS TO DOMINATE MARKET FOR AUTOMOTIVE APPLICATIONS DURING FORECAST PERIOD
FIGURE 45          MEMS AND MOEMS DEVICES TO EXHIBIT HIGHEST CAGR IN DIE BONDER EQUIPMENT MARKET FOR INDUSTRIAL APPLICATIONS DURING FORECAST PERIOD
FIGURE 46          IDM FIRMS TO LEAD DIE BONDER EQUIPMENT MARKET FOR HEALTHCARE APPLICATIONS DURING FORECAST PERIOD
FIGURE 47          DIE BONDER EQUIPMENT IN APAC TO GROW AT HIGHEST CARG DURING
FORECAST PERIOD
FIGURE 48          APAC: DIE BONDER EQUIPMENT MARKET SNAPSHOT
FIGURE 49          MEMS AND MOEMS DEVICES TO RECORD HIGHEST CARG IN DIE BONDER EQUIPMENT MARKET IN JAPAN DURING FORECAST PERIOD
FIGURE 50          AMERICAS: DIE BONDER EQUIPMENT MARKET SNAPSHOT
FIGURE 51          DIE BONDER EQUIPMENT MARKET IN CANADA FOR MEMS AND MOEMS DEVICES TO GROW AT HIGHEST CARG DURING FORECAST PERIOD
FIGURE 52          EMEA: DIE BONDER EQUIPMENT MARKET SNAPSHOT
FIGURE 53          GERMANY TO REGISTER HIGHEST CARG IN DIE BONDER EQUIPMENT MARKET IN EMEA DURING FORECAST PERIOD
FIGURE 54          MEMES AND MOEMS DEVICES TO EXHIBIT HIGHEST CARG IN FRENCH DIE BONDER EQUIPMENT MARKET DURING FORECAST PERIOD
FIGURE 55          COMPANIES ADOPTED PRODUCT LAUNCHES AS KEY GROWTH STRATEGIES
FROM 2017 TO 2019
FIGURE 56          RANKING OF TOP 5 PLAYERS IN DIE BONDER EQUIPMENT MARKET
FIGURE 57          DIE BONDER EQUIPMENT MARKET (GLOBAL) COMPETITIVE LEADERSHIP
MAPPING, 2018
FIGURE 58          BE SEMICONDUCTOR INDUSTRIES N.V.: COMPANY SNAPSHOT
FIGURE 59          ASM PACIFIC TECHNOLOGY LTD: COMPANY SNAPSHOT
FIGURE 60          KULICKE & SOFFA: COMPANY SNAPSHOT
FIGURE 61          MYCRONIC AB: COMPANY SNAPSHOT



掲載企業リスト

プレスリリース

プレスリリース

Memo.png当レポートのプレスリリースは発行されておりません。

資料検索

お探しの資料・レポートをキーワードで検索ください。

当サイト内の検索結果が表示されます。調査レポートは英文目次を掲載しているため、英語検索も有効です。
(ブラウザのスクリプトを有効にしないとサーチエンジンが表示されません)

お問い合わせ

2714110_0.jpg
レポートをお探しいたします。
当サイトに掲載されているレポート以外にも幅広くご提案可能です。レポートの内容に関するご質問、ご確認にも回答いたします。お気軽にお問い合わせください。