マーケットレポート詳細
3Dスタッキングの世界市場：メソッド別、デバイスタイプ別2028年予測
3D Stacking Market by Method (Die-to-Die, Die-to-Wafer, Wafer-to-Wafer, Chip-to-Chip, Chip-to-Wafer), Technology (Through-Silicon Via, Hybrid Bonding, Monolithic 3D Integration), Device (Logic ICs, Optoelectronics, Memory, MEMS) - Global Forecast to 2028
- 出版元：MarketsandMarkets
出版元について - 発行年：2023年10月
- 定価 ：Single User License(1名様ライセンス)US$4,950(米国ドル)/ Multi User License(5名様)$6,650 / Corporate User License $8,150
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- 商品コード：MAM3410
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【レポート紹介】
3Dスタッキングの世界市場規模は2023年の12億ドルから、2028年までに31億ドルへと急成長し、2023年から2028年にかけての市場の平均年成長率は20.4%で推移することが見込まれています。
レポートは3Dスタッキングの世界市場について2028年までの市場予測データ(金額US$)を掲載しています。同市場をさまざまな区分で細分化し、そのセグメント市場ごとの市場予測（メソッド別市場、相互接続技術別市場、等）を中心に構成されています。また競合状況、主要企業情報（17社）、市場ダイナミクス、サプライチェーン分析などの分析も加味し、3Dスタッキング市場の動向および今後成長性を詳細にレポートしています。
【レポート構成概要】
◆3Dスタッキングの世界市場予測2019-2028年
・市場規模(US$)
◆メソッド別、市場-2028年
・ダイtoダイ（D2D）
・ダイtoウエハ（D2W）
・ウエハtoウエハ（W2W）
・ウエハtoチップ
・チップtoチップ（C2C）
※(市場規模US$)
◆相互接続技術別、市場-2028年
・３Dハイブリッドボンディング
・３Dシリコン貫通電極（TSV）
・モノリシック３D
※(市場規模US$)
◆デバイスタイプ別、市場-2028年
・ロジックIC
・イメージング/オプトエレクトロニクス
・メモリデバイス
・MEMS(微小電気機械システム)/センサ
・発光ダイオード（LED）
・その他
※(市場規模US$)
◆エンドユーザー別、市場-2028年
・コンシューマーエレクトロニクス
・マニュファクチャリング
・通信
・自動車
・ヘルスケア
・その他
※(市場規模US$)
◆主要国地域別市場-2028年
北米
・米国、カナダ、メキシコ
欧州
・ドイツ、フランス、英国
・その他欧州
アジア太平洋
・日本、中国、韓国、台湾
・その他アジア太平洋
その他地域
・中東アフリカ
・南米
※国地域別にエンドユーザー別の細分化データ掲載、詳細は目次参照
◆市場分析
・市場ダイナミクス（促進要因、障壁、機会、課題）
・サプライチェーン分析
・エコシステムマッピング
・価格分析
・業界構造分析（ファイブフォース分析）
・主要なステークホルダーと購買基準
・貿易分析
・特許分析
・規格と規制の状況
・競合状況
・市場シェア分析
◆3Dスタッキングの主要企業プロフィール動向
・TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED
・SAMSUNG
・INTEL CORPORATION
・SK HYNIX INC.
・ADVANCED MICRO DEVICES, INC.
・ASE TECHNOLOGY HOLDING CO., LTD.
・AMKOR TECHNOLOGY
・JIANGSU CHANGDIAN TECHNOLOGY CO., LTD.
・TEXAS INSTRUMENTS INCORPORATED
・UNITED MICROELECTRONICS CORPORATION
・POWERTECH TECHNOLOGY INC.
・CADENCE DESIGN SYSTEMS, INC.
・BROADCOM
・TOWER SEMICONDUCTOR
・IBM
・東京エレクトロン株式会社
・CEA-LETI
（その他企業）
・SILICONWARE PRECISION INDUSTRIES CO., LTD.
・GLOBALFOUNDRIES INC.
・NHANCED SEMICONDUCTORS
・DECA TECHNOLOGIES
・TEZZARON
・TELEDYNE TECHNOLOGIES INCORPORATED
・HUAWEI TECHNOLOGIES CO. LTD.
・QUALCOMM TECHNOLOGIES, INC.
・3M
・AYAR LABS, INC.
・APPLIED MATERIALS, INC.
・MONOLITHIC 3D INC.
・MOLDEX3D
・CEREBRAS
・XPERI INC.
【レポート詳細目次、データ項目一覧は当ページ下を参照ください】
Table of Contents (英文詳細目次）
1 INTRODUCTION
1.1 STUDY OBJECTIVES
1.2 MARKET DEFINITION
1.2.1 INCLUSIONS AND EXCLUSIONS
1.3 STUDY SCOPE 32
・ FIGURE 1 3D STACKING MARKET: MARKET SEGMENTATION
1.3.1 REGIONAL SCOPE
1.3.2 YEARS CONSIDERED 33
1.4 CURRENCY CONSIDERED
1.5 LIMITATIONS 34
1.6 STAKEHOLDERS
1.7 RECESSION IMPACT
2 RESEARCH METHODOLOGY
2.1 RESEARCH DATA
・ FIGURE 2 3D STACKING MARKET: RESEARCH DESIGN
2.1.1 SECONDARY & PRIMARY RESEARCH
2.1.2 SECONDARY DATA
2.1.2.1 MAJOR SECONDARY SOURCES
2.1.2.2 SECONDARY SOURCES
2.1.3 PRIMARY DATA
2.1.4 BREAKDOWN OF PRIMARIES
2.1.4.1 KEY DATA FROM PRIMARY SOURCES
2.2 MARKET SIZE ESTIMATION
・ FIGURE 3 PROCESS FLOW OF MARKET SIZE ESTIMATION
2.2.1 BOTTOM-UP APPROACH
2.2.1.1 APPROACH TO ESTIMATE MARKET SHARE BY BOTTOM-UP ANALYSIS (DEMAND SIDE)
・ FIGURE 4 MARKET SIZE ESTIMATION: BOTTOM-UP APPROACH
2.2.2 TOP-DOWN APPROACH 42
2.2.2.1 APPROACH TO ESTIMATE MARKET SHARE BY TOP-DOWN ANALYSIS (SUPPLY SIDE)
・ FIGURE 5 MARKET SIZE ESTIMATION: TOP-DOWN APPROACH
・ FIGURE 6 MARKET SIZE ESTIMATION: TOP-DOWN APPROACH (SUPPLY SIDE)—REVENUE GENERATED FROM 3D STACKING SOLUTIONS AND SERVICES
2.3 DATA TRIANGULATION
・ FIGURE 7 DATA TRIANGULATION
2.4 RESEARCH ASSUMPTIONS
・ TABLE 1 RESEARCH ASSUMPTIONS
2.5 RISK ASSESSMENT
2.6 RECESSION IMPACT ANALYSIS: PARAMETERS CONSIDERED
3 EXECUTIVE SUMMARY
・ FIGURE 8 CONSUMER ELECTRONICS SEGMENT TO CAPTURE LARGEST SHARE OF 3D STACKING MARKET IN 2028
・ FIGURE 9 MEMORY DEVICES SEGMENT TO HOLD LARGEST SHARE OF 3D STACKING MARKET IN 2028
・ FIGURE 10 3D TSV SEGMENT TO LEAD 3D STACKING MARKET DURING FORECAST PERIOD
・ FIGURE 11 3D STACKING MARKET TO EXHIBIT HIGHEST CAGR IN ASIA PACIFIC DURING FORECAST PERIOD
4 PREMIUM INSIGHTS
4.1 ATTRACTIVE OPPORTUNITIES FOR PLAYERS IN 3D STACKING MARKET
・ FIGURE 12 INCREASING FOCUS ON MINIATURIZATION AND EFFICIENT SPACE UTILIZATION IN ELECTRONIC DEVICES TO BOOST MARKET GROWTH
4.2 3D STACKING MARKET, BY METHOD
・ FIGURE 13 DIE-TO-DIE SEGMENT TO HOLD LARGEST SHARE OF 3D STACKING MARKET IN 2028
4.3 3D STACKING MARKET, BY END USER
・ FIGURE 14 AUTOMOTIVE SEGMENT TO REGISTER HIGHEST CAGR FROM 2023 TO 2028
4.4 3D STACKING MARKET, BY PACKAGING TECHNOLOGY
・ FIGURE 15 3D TSV SEGMENT TO ACCOUNT FOR LARGEST SHARE OF 3D STACKING MARKET FROM 2023 TO 2028
4.5 3D STACKING MARKET, BY DEVICE TYPE
・ FIGURE 16 MEMORY DEVICES SEGMENT TO HOLD LARGEST SHARE OF 3D STACKING MARKET FROM 2023 TO 2028
4.6 ASIA PACIFIC: 3D STACKING MARKET, BY END USER AND COUNTRY
・ FIGURE 17 CONSUMER ELECTRONICS SEGMENT AND CHINA HELD LARGEST SHARE OF 3D STACKING MARKET IN ASIA PACIFIC IN 2022
4.7 3D STACKING MARKET, BY COUNTRY
・ FIGURE 18 TAIWAN TO BE FASTEST-GROWING COUNTRY-LEVEL MARKET FOR 3D STACKING DURING FORECAST PERIOD
5 MARKET OVERVIEW
5.1 INTRODUCTION
5.2 MARKET DYNAMICS
・ FIGURE 19 3D STACKING MARKET: DRIVERS, RESTRAINTS, OPPORTUNITIES, AND CHALLENGES
5.2.1 DRIVERS
・ FIGURE 20 ANALYSIS OF IMPACT OF DRIVERS ON 3D STACKING MARKET
5.2.1.1 INCREASING FOCUS ON MINIATURIZATION AND EFFICIENT SPACE UTILIZATION IN ELECTRONIC DEVICES
5.2.1.2 COST ADVANTAGE OFFERED BY 3D STACKING TECHNOLOGY
5.2.1.3 GROWING DEMAND FOR CONSUMER ELECTRONICS AND GAMING DEVICES
・ FIGURE 21 NUMBER OF SMARTPHONE AND MOBILE PHONE USERS GLOBALLY, 2020–2025
5.2.1.4 UNPARALLELED FLEXIBILITY AND CUSTOMIZATION BENEFITS OFFERED BY 3D STACKING IN ELECTRONIC COMPONENT MANUFACTURING
5.2.1.5 REDUCED POWER CONSUMPTION AND OPERATIONAL COSTS OVER 2D STACKING 57
5.2.2 RESTRAINTS
・ FIGURE 22 ANALYSIS OF IMPACT OF RESTRAINTS ON 3D STACKING MARKET
5.2.2.1 NEED FOR SUBSTANTIAL UPFRONT INVESTMENT
5.2.2.2 LACK OF STANDARDIZATION GOVERNING 3D STACKING TECHNOLOGY
5.2.3 OPPORTUNITIES
・ FIGURE 23 ANALYSIS OF IMPACT OF OPPORTUNITIES ON 3D STACKING MARKET
5.2.3.1 GROWING ADOPTION OF HIGH-BANDWIDTH MEMORY (HBM) DEVICES
5.2.3.2 RAPID EXPANSION OF SEMICONDUCTOR APPLICATIONS ACROSS VARIOUS INDUSTRIES
5.2.3.3 INTEGRATION OF ADVANCED ELECTRONICS INTO AUTOMOBILES
5.2.4 CHALLENGES
・ FIGURE 24 ANALYSIS OF IMPACT OF CHALLENGES ON 3D STACKING MARKET
5.2.4.1 MAINTAINING EFFECTIVE SUPPLY CHAIN IN 3D STACKING
5.2.4.2 DESIGNING COMPLEXITIES ASSOCIATED WITH 3D STACKING TECHNOLOGY
5.3 SUPPLY CHAIN ANALYSIS
・ FIGURE 25 3D STACKING MARKET: SUPPLY CHAIN ANALYSIS
5.4 ECOSYSTEM MAPPING
・ FIGURE 26 3D STACKING ECOSYSTEM
5.5 TRENDS/DISRUPTIONS IMPACTING CUSTOMER BUSINESS
・ FIGURE 27 REVENUE SHIFTS AND NEW REVENUE POCKETS FOR PLAYERS IN 3D STACKING MARKET
5.6 PRICING ANALYSIS
・ TABLE 2 AVERAGE SELLING PRICE OF 12-INCH EQUIVALENT WAFERS, 2022 (USD)
5.6.1 AVERAGE SELLING PRICE OF 12-INCH EQUIVALENT WAFERS OFFERED BY KEY PLAYERS
・ FIGURE 28 AVERAGE SELLING PRICE OF 12-INCH WAFERS EQUIVALENT OFFERED BY KEY PLAYERS
5.6.2 AVERAGE SELLING PRICE TREND
・ TABLE 3 AVERAGE SELLING PRICE OF 12-INCH EQUIVALENT WAFERS, 2018–2022 (USD/THOUSAND UNITS)
・ FIGURE 29 AVERAGE SELLING PRICE OF WAFERS, 2018–2022
5.7 TECHNOLOGY TRENDS
5.7.1 FAN-OUT WAFER-LEVEL PACKAGING
5.7.2 FAN-OUT PANEL-LEVEL PACKAGING
5.7.3 ADVANCED MATERIALS
5.7.4 MONOLITHIC 3D INTEGRATION
5.8 PORTER’S FIVE FORCES ANALYSIS
・ TABLE 4 3D STACKING MARKET: PORTER’S FIVE FORCES ANALYSIS
・ FIGURE 30 PORTER’S FIVE FORCES ANALYSIS
5.8.1 THREAT OF NEW ENTRANTS
5.8.2 THREAT OF SUBSTITUTES
5.8.3 BARGAINING POWER OF SUPPLIERS
5.8.4 BARGAINING POWER OF BUYERS
5.8.5 INTENSITY OF COMPETITIVE RIVALRY
5.9 KEY STAKEHOLDERS AND BUYING CRITERIA
5.9.1 KEY STAKEHOLDERS IN BUYING PROCESS
・ FIGURE 31 INFLUENCE OF STAKEHOLDERS ON BUYING PROCESS FOR TOP THREE END USERS
・ TABLE 5 INFLUENCE OF STAKEHOLDERS ON BUYING PROCESS, BY END USER (%)
5.9.2 BUYING CRITERIA 72
・ FIGURE 32 KEY BUYING CRITERIA FOR TOP THREE END USERS
・ TABLE 6 KEY BUYING CRITERIA, BY END USER
5.10 CASE STUDY ANALYSIS
5.10.1 SEMICONDUCTOR WAFER PRODUCER REDUCED WAFER REJECTIONS THROUGH CLOSED-LOOP MONITORING
5.10.2 SPTS’S DRIE TECHNOLOGY STRENGTHENED IMEC’S SILICON ETCH PLATFORM
5.11 TRADE ANALYSIS
5.11.1 IMPORT SCENARIO 73
・ TABLE 7 IMPORT DATA FOR PRODUCTS COVERED UNDER HS CODE 381800, BY COUNTRY, 2018–2022 (USD MILLION)
5.11.2 EXPORT SCENARIO 74
・ TABLE 8 EXPORT DATA FOR PRODUCTS COVERED UNDER HS CODE 381800, BY COUNTRY, 2018–2022 (USD MILLION)
5.12 PATENT ANALYSIS
・ TABLE 9 PATENTS RELATED TO 3D STACKING MARKET, 2020–2023
・ FIGURE 33 NUMBER OF PATENTS GRANTED PER YEAR FROM 2013 TO 2022
・ TABLE 10 NUMBER OF PATENTS RELATED TO 3D STACKING REGISTERED IN LAST 10 YEARS
・ FIGURE 34 TOP 10 COMPANIES WITH HIGHEST NUMBER OF PATENT APPLICATIONS IN LAST 10 YEARS
5.13 KEY CONFERENCES AND EVENTS, 2023–2025
・ TABLE 11 3D STACKING MARKET: DETAILED LIST OF CONFERENCES AND EVENTS
5.14 STANDARDS AND REGULATORY LANDSCAPE
5.14.1 REGULATORY BODIES, GOVERNMENT AGENCIES, AND OTHER ORGANIZATIONS
・ TABLE 12 NORTH AMERICA: REGULATORY BODIES, GOVERNMENT AGENCIES, AND OTHER ORGANIZATIONS
・ TABLE 13 EUROPE: REGULATORY BODIES, GOVERNMENT AGENCIES, AND OTHER ORGANIZATIONS
・ TABLE 14 ASIA PACIFIC: REGULATORY BODIES, GOVERNMENT AGENCIES, AND OTHER ORGANIZATIONS
5.14.2 KEY REGULATIONS AND STANDARDS
5.14.2.1 REGULATIONS
5.14.2.2 STANDARDS
6 3D STACKING MARKET, BY PACKAGING METHODOLOGY
6.1 INTRODUCTION
6.2 3D PACKAGE-ON-PACKAGE (POP)
6.2.1 GROWING DEMAND FOR COMPACT AND FEATURE-RICH ELECTRONIC DEVICES TO PROPEL SEGMENTAL GROWTH
6.3 3D SYSTEM-IN-PACKAGE (SIP)
6.3.1 NEED FOR MINIATURIZED AND POWER-EFFICIENT DEVICES ACROSS DIVERSE APPLICATIONS TO DRIVE SEGMENT
6.4 3D CHIP-ON-CHIP (COC)
6.4.1 NEED FOR COMPACT SOLUTIONS IN HIGH-PERFORMANCE COMPUTING APPLICATIONS TO FUEL SEGMENTAL GROWTH
6.5 WAFER LEVEL CHIP SCALE PACKAGING (WLCSP)
6.5.1 NEED TO REDUCE CONSUMPTION OF PACKAGING MATERIAL TO PROPEL ADOPTION OF WLCSP TECHNOLOGY
7 3D STACKING MARKET, BY METHOD
7.1 INTRODUCTION
・ FIGURE 35 WAFER-TO-CHIP SEGMENT TO REGISTER HIGHEST CAGR IN 3D STACKING MARKET DURING FORECAST PERIOD
・ TABLE 15 3D STACKING MARKET, BY METHOD, 2019–2022 (USD MILLION)
・ TABLE 16 3D STACKING MARKET, BY METHOD, 2023–2028 (USD MILLION)
7.2 DIE-TO-DIE 88
7.2.1 RISING NEED FOR COMPACT AND EFFICIENT DEVICE STRUCTURES TO BOOST ADOPTION OF DIE-TO-DIE STACKING
・ TABLE 17 DIE-TO-DIE: 3D STACKING MARKET, BY INTERCONNECTING TECHNOLOGY, 2019–2022 (USD MILLION)
・ TABLE 18 DIE-TO-DIE: 3D STACKING MARKET, BY INTERCONNECTING TECHNOLOGY, 2023–2028 (USD MILLION)
7.3 DIE-TO-WAFER
7.3.1 INCREASING FOCUS ON DEVICE PERFORMANCE ENHANCEMENT TO FUEL ADOPTION OF DIE-TO-WAFER INTEGRATION IN 3D STACKING
・ TABLE 19 DIE-TO-WAFER: 3D STACKING MARKET, BY INTERCONNECTING TECHNOLOGY, 2019–2022 (USD MILLION)
・ TABLE 20 DIE-TO-WAFER: 3D STACKING MARKET, BY INTERCONNECTING TECHNOLOGY, 2023–2028 (USD MILLION)
7.4 WAFER-TO-WAFER
7.4.1 GROWING DEMAND FOR ADVANCED COMPACT PACKAGING SOLUTIONS TO FUEL SEGMENTAL GROWTH
・ TABLE 21 WAFER-TO-WAFER: 3D STACKING MARKET, BY INTERCONNECTING TECHNOLOGY, 2019–2022 (USD MILLION)
・ TABLE 22 WAFER-TO-WAFER: 3D STACKING MARKET, BY INTERCONNECTING TECHNOLOGY, 2023–2028 (USD MILLION)
7.5 WAFER-TO-CHIP
7.5.1 RISING NEED FOR COMPACT AND EFFICIENT PACKAGING SOLUTIONS IN AUTOMOTIVE ELECTRONICS TO DRIVE SEGMENT
・ TABLE 23 WAFER-TO-CHIP: 3D STACKING MARKET, BY INTERCONNECTING TECHNOLOGY, 2019–2022 (USD MILLION)
・ TABLE 24 WAFER-TO-CHIP: 3D STACKING MARKET, BY INTERCONNECTING TECHNOLOGY, 2023–2028 (USD MILLION)
7.6 CHIP-TO-CHIP
7.6.1 GROWING NEED FOR HIGH-PERFORMANCE AND POWER-EFFICIENT ELECTRONIC DEVICES TO PROPEL SEGMENTAL GROWTH
・ TABLE 25 CHIP-TO-CHIP: 3D STACKING MARKET, BY INTERCONNECTING TECHNOLOGY, 2019–2022 (USD MILLION)
・ TABLE 26 CHIP-TO-CHIP: 3D STACKING MARKET, BY INTERCONNECTING TECHNOLOGY, 2023–2028 (USD MILLION)
8 3D STACKING MARKET, BY INTERCONNECTING TECHNOLOGY
8.1 INTRODUCTION
・ FIGURE 36 3D TSV SEGMENT TO CAPTURE LARGEST SHARE OF 3D STACKING MARKET DURING FORECAST PERIOD
・ TABLE 27 3D STACKING MARKET, BY INTERCONNECTING TECHNOLOGY, 2019–2022 (USD MILLION)
・ TABLE 28 3D STACKING MARKET, BY INTERCONNECTING TECHNOLOGY, 2023–2028 (USD MILLION)
8.2 3D HYBRID BONDING
8.2.1 ADOPTION OF 3D HYBRID BONDING IN HIGH-PERFORMANCE COMPUTING AND DATA-INTENSIVE APPLICATIONS TO DRIVE MARKET
・ TABLE 29 3D HYBRID BONDING: 3D STACKING MARKET, BY METHOD, 2019–2022 (USD MILLION)
・ TABLE 30 3D HYBRID BONDING: 3D STACKING MARKET, BY METHOD, 2023–2028 (USD MILLION)
8.3 3D THROUGH-SILICON VIA (TSV)
・ TABLE 31 3D TSV: 3D STACKING MARKET, BY METHOD, 2019–2022 (USD MILLION)
・ TABLE 32 3D TSV: 3D STACKING MARKET, BY METHOD, 2023–2028 (USD MILLION)
8.3.1 VIA-FIRST TSV
8.3.1.1 INCREASING ADOPTION OF VIA-FIRST TSV IN APPLICATIONS REQUIRING EARLY-STAGE INTEGRATION TO DRIVE MARKET
8.3.2 VIA-MIDDLE TSV
8.3.2.1 NEED FOR FLEXIBILITY IN VERTICAL CONNECTIONS IN SEMICONDUCTOR DESIGN TO INCREASE DEMAND FOR VIA-MIDDLE TSV TECHNOLOGY
8.3.3 VIA-LAST TSV
8.3.3.1 GROWING ADOPTION OF VIA-LAST TSV TECHNOLOGY IN APPLICATIONS REQUIRING LATE-STAGE INTERCONNECTION TO DRIVE MARKET
8.3.4 HYBRID TSV
8.3.4.1 ABILITY TO MEET SPECIFIC DESIGN AND PERFORMANCE REQUIREMENTS TO FUEL ADOPTION OF HYBRID TSV
8.3.5 DEEP TRENCH TSV 98
8.3.5.1 RISING DEMAND FOR ENHANCED ELECTRICAL PERFORMANCE IN ADVANCED MICROPROCESSORS AND MEMORY DEVICES TO DRIVE MARKET
8.3.6 MICROBUMP TSV
8.3.6.1 RISING DEMAND FOR MINIATURIZED AND DENSELY INTERCONNECTED SEMICONDUCTOR DEVICES TO FUEL MARKET GROWTH
8.3.7 THROUGH GLASS VIA (TGV)
8.3.7.1 RISING ADOPTION OF TGV TECHNIQUE IN APPLICATIONS REQUIRING TRANSPARENT AND HERMETIC PACKAGING TO DRIVE MARKET
8.4 MONOLITHIC 3D
8.4.1 ABILITY TO ADDRESS LIMITATIONS OF ADVANCED CMOS SCALING TO FUEL DEMAND FOR MONOLITHIC 3D INTEGRATION
・ TABLE 33 MONOLITHIC 3D INTEGRATION: 3D STACKING MARKET, BY METHOD, 2019–2022 (USD MILLION)
・ TABLE 34 MONOLITHIC 3D INTEGRATION: 3D STACKING MARKET, BY METHOD, 2023–2028 (USD MILLION)
9 3D STACKING MARKET, BY DEVICE TYPE
9.1 INTRODUCTION
・ FIGURE 37 MEMS/SENSORS SEGMENT TO REGISTER HIGHEST CAGR IN 3D STACKING MARKET DURING FORECAST PERIOD
・ TABLE 35 3D STACKING MARKET, BY DEVICE TYPE, 2019–2022 (USD MILLION)
・ TABLE 36 3D STACKING MARKET, BY DEVICE TYPE, 2023–2028 (USD MILLION)
9.2 LOGIC ICS 103
9.2.1 RISING NEED FOR HIGH COMPUTATIONAL EFFICIENCY TO INDUCE DEMAND FOR LOGIC ICS
・ TABLE 37 LOGIC ICS: 3D STACKING MARKET, BY END USER, 2019–2022 (USD MILLION)
・ TABLE 38 LOGIC ICS: 3D STACKING MARKET, BY END USER, 2023–2028 (USD MILLION)
9.3 IMAGING & OPTOELECTRONICS
9.3.1 POTENTIAL TO IMPROVE IMAGE PROCESSING AND OPTICAL FUNCTIONALITIES TO SPUR ADOPTION OF 3D STACKING
・ TABLE 39 IMAGING & OPTOELECTRONICS: 3D STACKING MARKET, BY END USER, 2019–2022 (USD MILLION)
・ TABLE 40 IMAGING & OPTOELECTRONICS: 3D STACKING MARKET, BY END USER, 2023–2028 (USD MILLION)
9.4 MEMORY DEVICES
9.4.1 SURGING DEMAND FOR HIGH-BANDWIDTH MEMORY TO FOSTER MARKET GROWTH
・ TABLE 41 MEMORY DEVICES: 3D STACKING MARKET, BY END USER, 2019–2022 (USD MILLION)
・ TABLE 42 MEMORY DEVICES: 3D STACKING MARKET, BY END USER, 2023–2028 (USD MILLION)
9.5 MEMS/SENSORS
9.5.1 GROWING REQUIREMENT FOR COMPACT AND ACCURATE SENSING TECHNOLOGIES TO FUEL UPTAKE OF 3D STACKING
・ TABLE 43 MEMS/SENSORS: 3D STACKING MARKET, BY END USER, 2019–2022 (USD MILLION)
・ TABLE 44 MEMS/SENSORS: 3D STACKING MARKET, BY END USER, 2023–2028 (USD MILLION)
9.6 LIGHT EMITTING DIODES (LEDS)
9.6.1 RISING DEMAND FOR INNOVATIVE DESIGNS AND IMPROVED LUMINOSITY IN LEDS TO FUEL SEGMENTAL GROWTH
・ TABLE 45 LEDS: 3D STACKING MARKET, BY END USER, 2019–2022 (USD MILLION)
・ TABLE 46 LEDS: 3D STACKING MARKET, BY END USER, 2023–2028 (USD MILLION)
9.7 OTHERS
・ TABLE 47 OTHERS: 3D STACKING MARKET, BY END USER, 2019–2022 (USD MILLION)
・ TABLE 48 OTHERS: 3D STACKING MARKET, BY END USER, 2023–2028 (USD MILLION)
10 3D STACKING MARKET, BY END USER
10.1 INTRODUCTION
・ FIGURE 38 AUTOMOTIVE SEGMENT TO RECORD HIGHEST CAGR IN 3D STACKING MARKET DURING FORECAST PERIOD
・ TABLE 49 3D STACKING MARKET, BY END USER, 2019–2022 (USD MILLION)
・ TABLE 50 3D STACKING MARKET, BY END USER, 2023–2028 (USD MILLION)
10.2 CONSUMER ELECTRONICS
10.2.1 INCREASING TECHNOLOGICAL ADVANCEMENTS IN CONSUMER ELECTRONICS TO DRIVE ADOPTION OF 3D STACKING
・ TABLE 51 CONSUMER ELECTRONICS: 3D STACKING MARKET, BY DEVICE TYPE, 2019–2022 (USD MILLION)
・ TABLE 52 CONSUMER ELECTRONICS: 3D STACKING MARKET, BY DEVICE TYPE, 2023–2028 (USD MILLION)
・ TABLE 53 CONSUMER ELECTRONICS: 3D STACKING MARKET, BY REGION, 2019–2022 (USD MILLION)
・ TABLE 54 CONSUMER ELECTRONICS: 3D STACKING MARKET, BY REGION, 2023–2028 (USD MILLION)
10.3 MANUFACTURING
10.3.1 INCREASING SHIFT TOWARD SMART FACTORIES AND INDUSTRY 4.0 TO FUEL ADOPTION OF 3D STACKING
・ TABLE 55 MANUFACTURING: 3D STACKING MARKET, BY DEVICE TYPE, 2019–2022 (USD MILLION)
・ TABLE 56 MANUFACTURING: 3D STACKING MARKET, BY DEVICE TYPE, 2023–2028 (USD MILLION)
・ TABLE 57 MANUFACTURING: 3D STACKING MARKET, BY REGION, 2019–2022 (USD MILLION)
・ TABLE 58 MANUFACTURING: 3D STACKING MARKET, BY REGION, 2023–2028 (USD MILLION)
10.4 COMMUNICATIONS
10.4.1 INTEGRATION OF ADVANCED FUNCTIONALITIES IN HIGH-PERFORMANCE COMPUTING APPLICATIONS TO DRIVE MARKET
・ TABLE 59 COMMUNICATIONS: 3D STACKING MARKET, BY DEVICE TYPE, 2019–2022 (USD MILLION)
・ TABLE 60 COMMUNICATIONS: 3D STACKING MARKET, BY DEVICE TYPE, 2023–2028 (USD MILLION)
・ TABLE 61 COMMUNICATIONS: 3D STACKING MARKET, BY REGION, 2019–2022 (USD MILLION)
・ TABLE 62 COMMUNICATIONS: 3D STACKING MARKET, BY REGION, 2023–2028 (USD MILLION)
10.5 AUTOMOTIVE 119
10.5.1 RISING DEMAND FOR COMPACT AND POWERFUL AUTOMOTIVE ELECTRONIC SYSTEMS TO PROPEL MARKET GROWTH
・ TABLE 63 AUTOMOTIVE: 3D STACKING MARKET, BY DEVICE TYPE, 2019–2022 (USD MILLION)
・ TABLE 64 AUTOMOTIVE: 3D STACKING MARKET, BY DEVICE TYPE, 2023–2028 (USD MILLION)
・ TABLE 65 AUTOMOTIVE: 3D STACKING MARKET, BY REGION, 2019–2022 (USD MILLION)
・ TABLE 66 AUTOMOTIVE: 3D STACKING MARKET, BY REGION, 2023–2028 (USD MILLION)
10.6 HEALTHCARE 121
10.6.1 SURGING DEMAND FOR ADVANCED MEDICAL EQUIPMENT FOR HIGH PERFORMANCE AND EFFICIENCY TO FUEL MARKET GROWTH
・ TABLE 67 HEALTHCARE: 3D STACKING MARKET, BY DEVICE TYPE, 2019–2022 (USD MILLION)
・ TABLE 68 HEALTHCARE: 3D STACKING MARKET, BY DEVICE TYPE, 2023–2028 (USD MILLION)
・ TABLE 69 HEALTHCARE: 3D STACKING MARKET, BY REGION, 2019–2022 (USD MILLION)
・ TABLE 70 HEALTHCARE: 3D STACKING MARKET, BY REGION, 2023–2028 (USD MILLION)
10.7 OTHERS
・ TABLE 71 OTHERS: 3D STACKING MARKET, BY DEVICE TYPE, 2019–2022 (USD MILLION)
・ TABLE 72 OTHERS: 3D STACKING MARKET, BY DEVICE TYPE, 2023–2028 (USD MILLION)
・ TABLE 73 OTHERS: 3D STACKING MARKET, BY REGION, 2019–2022 (USD MILLION)
・ TABLE 74 OTHERS: 3D STACKING MARKET, BY REGION, 2023–2028 (USD MILLION)
11 3D STACKING MARKET, BY REGION
11.1 INTRODUCTION
・ FIGURE 39 ASIA PACIFIC TO RECORD HIGHEST CAGR IN 3D STACKING MARKET DURING FORECAST PERIOD
・ TABLE 75 3D STACKING MARKET, BY REGION, 2019–2022 (USD MILLION)
・ TABLE 76 3D STACKING MARKET, BY REGION, 2023–2028 (USD MILLION)
11.2 NORTH AMERICA
・ FIGURE 40 NORTH AMERICA: 3D STACKING MARKET SNAPSHOT
・ TABLE 77 NORTH AMERICA: 3D STACKING MARKET, BY COUNTRY, 2019–2022 (USD MILLION)
・ TABLE 78 NORTH AMERICA: 3D STACKING MARKET, BY COUNTRY, 2023–2028 (USD MILLION)
・ TABLE 79 NORTH AMERICA: 3D STACKING MARKET, BY END USER, 2019–2022 (USD MILLION)
・ TABLE 80 NORTH AMERICA: 3D STACKING MARKET, BY END USER, 2023–2028 (USD MILLION)
11.2.1 US
11.2.1.1 PRESENCE OF FABRICATION BUSINESS GIANTS TO SUPPORT MARKET GROWTH
・ TABLE 81 US: 3D STACKING MARKET, BY END USER, 2019–2022 (USD MILLION)
・ TABLE 82 US: 3D STACKING MARKET, BY END USER, 2023–2028 (USD MILLION)
11.2.2 CANADA
11.2.2.1 INCREASING FOCUS ON INNOVATION AND TECHNOLOGICAL ADVANCEMENTS TO FOSTER MARKET GROWTH
・ TABLE 83 CANADA: 3D STACKING MARKET, BY END USER, 2019–2022 (USD MILLION)
・ TABLE 84 CANADA: 3D STACKING MARKET, BY END USER, 2023–2028 (USD MILLION)
11.2.3 MEXICO
11.2.3.1 GOVERNMENT-LED INITIATIVES TO DEVELOP SEMICONDUCTOR INDUSTRY TO FUEL MARKET GROWTH
・ TABLE 85 MEXICO: 3D STACKING MARKET, BY END USER, 2019–2022 (USD MILLION)
・ TABLE 86 MEXICO: 3D STACKING MARKET, BY END USER, 2023–2028 (USD MILLION)
11.2.4 NORTH AMERICA: RECESSION IMPACT
11.3 EUROPE
・ FIGURE 41 EUROPE: 3D STACKING MARKET SNAPSHOT
・ TABLE 87 EUROPE: 3D STACKING MARKET, BY COUNTRY, 2019–2022 (USD MILLION)
・ TABLE 88 EUROPE: 3D STACKING MARKET, BY COUNTRY, 2023–2028 (USD MILLION)
・ TABLE 89 EUROPE: 3D STACKING MARKET, BY END USER, 2019–2022 (USD MILLION)
・ TABLE 90 EUROPE: 3D STACKING MARKET, BY END USER, 2023–2028 (USD MILLION)
11.3.1 GERMANY
11.3.1.1 GROWING PRODUCTION OF AUTOMOBILES TO CREATE DEMAND FOR 3D STACKING
・ TABLE 91 GERMANY: 3D STACKING MARKET, BY END USER, 2019–2022 (USD MILLION)
・ TABLE 92 GERMANY: 3D STACKING MARKET, BY END USER, 2023–2028 (USD MILLION)
11.3.2 FRANCE
11.3.2.1 INCREASING R&D IN 3D STACKING TO DRIVE MARKET
・ TABLE 93 FRANCE: 3D STACKING MARKET, BY END USER, 2019–2022 (USD MILLION)
・ TABLE 94 FRANCE: 3D STACKING MARKET, BY END USER, 2023–2028 (USD MILLION)
11.3.3 UK
11.3.3.1 5G IMPLEMENTATION TO CREATE CONDUCIVE ENVIRONMENT FOR MARKET GROWTH
・ TABLE 95 UK: 3D STACKING MARKET, BY END USER, 2019–2022 (USD MILLION)
・ TABLE 96 UK: 3D STACKING MARKET, BY END USER, 2023–2028 (USD MILLION)
11.3.4 REST OF EUROPE
・ TABLE 97 REST OF EUROPE: 3D STACKING MARKET, BY END USER, 2019–2022 (USD MILLION)
・ TABLE 98 REST OF EUROPE: 3D STACKING MARKET, BY END USER, 2023–2028 (USD MILLION)
11.3.5 EUROPE: RECESSION IMPACT
11.4 ASIA PACIFIC
・ FIGURE 42 ASIA PACIFIC: 3D STACKING MARKET SNAPSHOT
・ TABLE 99 ASIA PACIFIC: 3D STACKING MARKET, BY COUNTRY, 2019–2022 (USD MILLION)
・ TABLE 100 ASIA PACIFIC: 3D STACKING MARKET, BY COUNTRY, 2023–2028 (USD MILLION)
・ TABLE 101 ASIA PACIFIC: 3D STACKING MARKET, BY END USER, 2019–2022 (USD MILLION)
・ TABLE 102 ASIA PACIFIC: 3D STACKING MARKET, BY END USER, 2023–2028 (USD MILLION)
11.4.1 CHINA
11.4.1.1 INCREASING INVESTMENTS IN SEMICONDUCTOR INDUSTRY TO DRIVE MARKET
・ TABLE 103 CHINA: 3D STACKING MARKET, BY END USER, 2019–2022 (USD MILLION)
・ TABLE 104 CHINA: 3D STACKING MARKET, BY END USER, 2023–2028 (USD MILLION)
11.4.2 JAPAN
11.4.2.1 INCREASING FOCUS ON PRECISION ENGINEERING TO BOOST ADOPTION OF 3D STACKING
・ TABLE 105 JAPAN: 3D STACKING MARKET, BY END USER, 2019–2022 (USD MILLION)
・ TABLE 106 JAPAN: 3D STACKING MARKET, BY END USER, 2023–2028 (USD MILLION)
11.4.3 SOUTH KOREA
11.4.3.1 GROWING FOCUS ON INNOVATION AND RESEARCH TO CONTRIBUTE TO MARKET GROWTH
・ TABLE 107 SOUTH KOREA: 3D STACKING MARKET, BY END USER, 2019–2022 (USD MILLION)
・ TABLE 108 SOUTH KOREA: 3D STACKING MARKET, BY END USER, 2023–2028 (USD MILLION)
11.4.4 TAIWAN
11.4.4.1 RISING DEMAND FOR COMPACT, EFFICIENT, AND HIGH-PERFORMING CHIPS TO SUPPORT MARKET GROWTH
・ TABLE 109 TAIWAN: 3D STACKING MARKET, BY END USER, 2019–2022 (USD MILLION)
・ TABLE 110 TAIWAN: 3D STACKING MARKET, BY END USER, 2023–2028 (USD MILLION)
11.4.5 REST OF ASIA PACIFIC
・ TABLE 111 REST OF ASIA PACIFIC: 3D STACKING MARKET, BY END USER, 2019–2022 (USD MILLION)
・ TABLE 112 REST OF ASIA PACIFIC: 3D STACKING MARKET, BY END USER, 2023–2028 (USD MILLION)
11.4.6 ASIA PACIFIC: RECESSION IMPACT
11.5 REST OF THE WORLD (ROW)
・ TABLE 113 ROW: 3D STACKING MARKET, BY REGION, 2019–2022 (USD MILLION)
・ TABLE 114 ROW: 3D STACKING MARKET, BY REGION, 2023–2028 (USD MILLION)
・ TABLE 115 ROW: 3D STACKING MARKET, BY END USER, 2019–2022 (USD MILLION)
・ TABLE 116 ROW: 3D STACKING MARKET, BY END USER, 2023–2028 (USD MILLION)
11.5.1 MIDDLE EAST & AFRICA
11.5.1.1 GOVERNMENT INITIATIVES TO STRENGTHEN SEMICONDUCTOR INDUSTRY TO FAVOR MARKET GROWTH
・ TABLE 117 MIDDLE EAST & AFRICA: 3D STACKING MARKET, BY END USER, 2019–2022 (USD MILLION)
・ TABLE 118 MIDDLE EAST & AFRICA: 3D STACKING MARKET, BY END USER, 2023–2028 (USD MILLION)
11.5.2 SOUTH AMERICA
11.5.2.1 GROWING DEMAND FOR ADVANCED ARCHITECTURE AND HIGH-END COMPUTING TO CONTRIBUTE TO MARKET GROWTH
・ TABLE 119 SOUTH AMERICA: 3D STACKING MARKET, BY END USER, 2019–2022 (USD MILLION)
・ TABLE 120 SOUTH AMERICA: 3D STACKING MARKET, BY END USER, 2023–2028 (USD MILLION)
11.5.3 ROW: RECESSION IMPACT
12 COMPETITIVE LANDSCAPE
12.1 INTRODUCTION
12.2 STRATEGIES ADOPTED BY KEY PLAYERS
・ TABLE 121 OVERVIEW OF STRATEGIES ADOPTED BY KEY PLAYERS IN 3D STACKING MARKET
12.2.1 PRODUCT PORTFOLIO 156
12.2.2 REGIONAL FOCUS
12.2.3 ORGANIC/INORGANIC GROWTH STRATEGIES
12.3 MARKET SHARE ANALYSIS, 2022
・ TABLE 122 3D STACKING MARKET: MARKET SHARE ANALYSIS, 2022
12.4 REVENUE ANALYSIS OF KEY PLAYERS IN 3D STACKING MARKET
・ FIGURE 43 FIVE-YEAR REVENUE ANALYSIS OF KEY PLAYERS IN 3D STACKING MARKET
12.5 KEY COMPANY EVALUATION MATRIX, 2022
12.5.1 STARS
12.5.2 PERVASIVE PLAYERS 159
12.5.3 EMERGING LEADERS 160
12.5.4 PARTICIPANTS
・ FIGURE 44 3D STACKING MARKET (GLOBAL): KEY COMPANY EVALUATION MATRIX, 2022
12.6 COMPETITIVE BENCHMARKING
12.6.1 COMPANY FOOTPRINT, BY INTERCONNECTING METHOD
12.6.2 COMPANY FOOTPRINT, BY DEVICE TYPE
12.6.3 COMPANY FOOTPRINT, BY END USER
12.6.4 COMPANY FOOTPRINT, BY REGION
12.6.5 OVERALL COMPANY FOOTPRINT
12.7 STARTUPS/SMALL AND MEDIUM-SIZED ENTERPRISES (SMES) EVALUATION MATRIX, 2022
・ TABLE 123 3D STACKING MARKET: DETAILED LIST OF KEY STARTUPS/SMES
12.7.1 COMPETITIVE BENCHMARKING OF KEY STARTUPS/SMES
・ TABLE 124 COMPANY FOOTPRINT, BY INTERCONNECTING METHODS
・ TABLE 125 COMPANY FOOTPRINT, BY DEVICE TYPE
・ TABLE 126 COMPANY FOOTPRINT, BY END USER INDUSTRY
・ TABLE 127 COMPANY FOOTPRINT, BY REGION 167
12.7.2 PROGRESSIVE COMPANIES
12.7.3 RESPONSIVE COMPANIES
12.7.4 DYNAMIC COMPANIES 168
12.7.5 STARTING BLOCKS 168
・ FIGURE 45 3D STACKING MARKET (GLOBAL): STARTUPS/SMES EVALUATION MATRIX, 2022
12.8 COMPETITIVE SCENARIOS AND TRENDS
12.8.1 PRODUCT LAUNCHES & DEVELOPMENTS
・ TABLE 128 3D STACKING MARKET: PRODUCT LAUNCHES/DEVELOPMENTS, 2020–2023
12.8.2 DEALS
・ TABLE 129 3D STACKING MARKET: DEALS, 2020–2023
13 COMPANY PROFILES
13.1 INTRODUCTION
13.2 KEY PLAYERS 175
(BUSINESS OVERVIEW, PRODUCTS/SOLUTIONS/SERVICES OFFERED, RECENT DEVELOPMENTS, PRODUCT LAUNCHES, DEALS, MNM VIEW, KEY STRENGTHS/RIGHT TO WIN, STRATEGIC CHOICES, AND WEAKNESSES/COMPETITIVE THREATS)*
13.2.1 TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED
・ TABLE 130 TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED: COMPANY OVERVIEW
・ FIGURE 46 TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD: COMPANY SNAPSHOT
・ TABLE 131 TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED: PRODUCTS/SERVICES/SOLUTIONS OFFERED
・ TABLE 132 TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED: PRODUCT LAUNCHES
・ TABLE 133 TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED: DEALS
・ TABLE 134 TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED: OTHERS
13.2.2 SAMSUNG
・ TABLE 135 SAMSUNG: COMPANY OVERVIEW
・ FIGURE 47 SAMSUNG: COMPANY SNAPSHOT
・ TABLE 136 SAMSUNG: PRODUCTS/SERVICES/SOLUTIONS OFFERED
・ TABLE 137 SAMSUNG: PRODUCT LAUNCHES
・ TABLE 138 SAMSUNG: DEALS
13.2.3 INTEL CORPORATION 183
・ TABLE 139 INTEL CORPORATION: COMPANY OVERVIEW
・ FIGURE 48 INTEL CORPORATION: COMPANY SNAPSHOT
・ TABLE 140 INTEL CORPORATION: PRODUCTS/SERVICES/SOLUTIONS OFFERED
13.2.4 SK HYNIX INC.
・ TABLE 141 SK HYNIX INC.: COMPANY OVERVIEW
・ FIGURE 49 SK HYNIX INC.: COMPANY SNAPSHOT
・ TABLE 142 SK HYNIX INC.: PRODUCTS/SERVICES/SOLUTIONS OFFERED
・ TABLE 143 SK HYNIX INC.: DEALS
13.2.5 ADVANCED MICRO DEVICES, INC.
・ TABLE 144 ADVANCED MICRO DEVICES, INC.: COMPANY OVERVIEW
・ FIGURE 50 ADVANCED MICRO DEVICES, INC.: COMPANY SNAPSHOT
・ TABLE 145 ADVANCED MICRO DEVICES, INC.: PRODUCTS/SERVICES/SOLUTIONS OFFERED
・ TABLE 146 ADVANCED MICRO DEVICES, INC.: DEALS
13.2.6 ASE TECHNOLOGY HOLDING CO., LTD.
・ TABLE 147 ASE TECHNOLOGY HOLDING CO., LTD.: COMPANY OVERVIEW
・ FIGURE 51 ASE TECHNOLOGY HOLDING CO., LTD.: COMPANY SNAPSHOT
・ TABLE 148 ASE TECHNOLOGY HOLDING CO., LTD.: PRODUCTS/SERVICES/SOLUTIONS OFFERED
・ TABLE 149 ASE TECHNOLOGY HOLDING CO., LTD.: PRODUCT LAUNCHES
13.2.7 AMKOR TECHNOLOGY 197
・ TABLE 150 AMKOR TECHNOLOGY: COMPANY OVERVIEW
・ FIGURE 52 AMKOR TECHNOLOGY: COMPANY SNAPSHOT
・ TABLE 151 AMKOR TECHNOLOGY: PRODUCTS/SERVICES/SOLUTIONS OFFERED
・ TABLE 152 AMKOR TECHNOLOGY: DEALS
13.2.8 JIANGSU CHANGDIAN TECHNOLOGY CO., LTD.
・ TABLE 153 JIANGSU CHANGDIAN TECHNOLOGY CO., LTD.: COMPANY OVERVIEW
・ FIGURE 53 JIANGSU CHANGDIAN TECHNOLOGY CO., LTD.: COMPANY SNAPSHOT
・ TABLE 154 JIANGSU CHANGDIAN TECHNOLOGY CO., LTD.: PRODUCTS/SERVICES/SOLUTIONS OFFERED
・ TABLE 155 JIANGSU CHANGDIAN TECHNOLOGY CO., LTD.: PRODUCT LAUNCHES
・ TABLE 156 JIANGSU CHANGDIAN TECHNOLOGY CO., LTD.: DEALS
13.2.9 TEXAS INSTRUMENTS INCORPORATED
・ TABLE 157 TEXAS INSTRUMENTS INCORPORATED: COMPANY OVERVIEW
・ FIGURE 54 TEXAS INSTRUMENTS INCORPORATED: COMPANY SNAPSHOT
・ TABLE 158 TEXAS INSTRUMENTS INCORPORATED: PRODUCTS/SERVICES/SOLUTIONS OFFERED
・ TABLE 159 TEXAS INSTRUMENTS INCORPORATED: DEALS
13.2.10 UNITED MICROELECTRONICS CORPORATION
・ TABLE 160 UNITED MICROELECTRONICS CORPORATION: COMPANY OVERVIEW
・ FIGURE 55 UNITED MICROELECTRONICS CORPORATION: COMPANY SNAPSHOT
・ TABLE 161 UNITED MICROELECTRONICS CORPORATION: PRODUCTS/SERVICES/SOLUTIONS OFFERED
・ TABLE 162 UNITED MICROELECTRONICS CORPORATION: DEALS
13.2.11 POWERTECH TECHNOLOGY INC
・ TABLE 163 POWERTECH TECHNOLOGY INC: COMPANY OVERVIEW
・ FIGURE 56 POWERTECH TECHNOLOGY INC: COMPANY SNAPSHOT
・ TABLE 164 POWERTECH TECHNOLOGY INC: PRODUCTS/SERVICES/SOLUTIONS OFFERED
13.2.12 CADENCE DESIGN SYSTEMS, INC. 211
・ TABLE 165 CADENCE DESIGN SYSTEMS, INC.: COMPANY OVERVIEW
・ FIGURE 57 CADENCE DESIGN SYSTEMS, INC.: COMPANY SNAPSHOT
・ TABLE 166 CADENCE DESIGN SYSTEMS, INC.: PRODUCTS/SERVICES/SOLUTIONS OFFERED
・ TABLE 167 CADENCE DESIGN SYSTEMS, INC.: DEALS
13.2.13 BROADCOM
・ TABLE 168 BROADCOM: COMPANY OVERVIEW 214
・ FIGURE 58 BROADCOM: COMPANY SNAPSHOT 215
・ TABLE 169 BROADCOM: PRODUCTS/SERVICES/SOLUTIONS OFFERED
・ TABLE 170 BROADCOM: DEALS
13.2.14 TOWER SEMICONDUCTOR
・ TABLE 171 TOWER SEMICONDUCTOR: COMPANY OVERVIEW
・ FIGURE 59 TOWER SEMICONDUCTOR: COMPANY SNAPSHOT
・ TABLE 172 TOWER SEMICONDUCTOR: PRODUCTS/SERVICES/SOLUTIONS OFFERED
・ TABLE 173 TOWER SEMICONDUCTOR: DEALS 218
13.2.15 IBM
・ TABLE 174 IBM: COMPANY OVERVIEW
・ FIGURE 60 IBM: COMPANY SNAPSHOT
・ TABLE 175 IBM: PRODUCTS/SERVICES/SOLUTIONS OFFERED
・ TABLE 176 IBM: PRODUCT LAUNCHES
13.2.16 TOKYO ELECTRON LIMITED
・ TABLE 177 TOKYO ELECTRON LIMITED: COMPANY OVERVIEW
・ FIGURE 61 TOKYO ELECTRON LIMITED: COMPANY SNAPSHOT
・ TABLE 178 TOKYO ELECTRON LIMITED: PRODUCTS/SERVICES/SOLUTIONS OFFERED
・ TABLE 179 TOKYO ELECTRON LIMITED: PRODUCT LAUNCHES
13.2.17 CEA-LETI
・ TABLE 180 CEA-LETI: COMPANY OVERVIEW 225
・ TABLE 181 CEA-LETI: PRODUCTS/SERVICES/SOLUTIONS OFFERED
*DETAILS ON BUSINESS OVERVIEW, PRODUCTS/SOLUTIONS/SERVICES OFFERED, RECENT DEVELOPMENTS, PRODUCT LAUNCHES, DEALS, MNM VIEW, KEY STRENGTHS/RIGHT TO WIN, STRATEGIC CHOICES, AND WEAKNESSES/COMPETITIVE THREATS MIGHT NOT BE CAPTURED IN CASE OF UNLISTED COMPANIES.
13.3 OTHER PLAYERS
13.3.1 SILICONWARE PRECISION INDUSTRIES CO., LTD.
13.3.2 GLOBALFOUNDRIES INC.
13.3.3 NHANCED SEMICONDUCTORS
13.3.4 DECA TECHNOLOGIES 229
13.3.5 TEZZARON
13.3.6 TELEDYNE TECHNOLOGIES INCORPORATED
13.3.7 HUAWEI TECHNOLOGIES CO. LTD.
13.3.8 QUALCOMM TECHNOLOGIES, INC.
13.3.9 3M
13.3.10 AYAR LABS, INC.
13.3.11 APPLIED MATERIALS, INC.
13.3.12 MONOLITHIC 3D INC.
13.3.13 MOLDEX3D
13.3.14 CEREBRAS
13.3.15 XPERI INC.